H10W 72/642
Being orthogonal to a side surface of the chip
Official title: {being orthogonal to a side surface of the chip, e.g. in parallel arrangements}
H10W72/642 (Being orthogonal to a side surface of the chip) appears on 72 US grants and 90 published applications in this corpus.
Search patents in H10W- Granted patents
- 72
- Published applications
- 90
- Assignees
- 40
- Inventors
- 183
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 5 |
| 2013 | 4 | 2 |
| 2014 | 3 | 5 |
| 2015 | 3 | 5 |
| 2016 | 7 | 2 |
| 2017 | 3 | 5 |
| 2018 | 3 | 5 |
| 2019 | 3 | 5 |
| 2020 | 7 | 19 |
| 2021 | 15 | 9 |
| 2022 | 6 | 6 |
| 2023 | 7 | 5 |
| 2024 | 3 | 6 |
| 2025 | 5 | 4 |
| 2026 | 3 | 5 |
By publication year. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Flip chip assembly and process with sintering material on metal bumps41US 9,117,811 B2Tessera, Inc. · 2015
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- Flip chip semiconductor device4US 8,669,650 B2Alpha and Omega Semiconductor Incorporated · 2014