Packaging structure for a surface-mounting, power module comprising a plurality of semiconductor electronic devices

A process for packaging a power module for surface mounting, comprising:

• forming a multilayer support including a dissipating plate, an insulating layer over the dissipating plate, a first conductive island and a second conductive island over the insulating layer, the first and second conductive islands electrically isolated from each other;
• bonding a first face of a first die to the first conductive island;
• bonding a first face of a second die to the second conductive island;
• coupling a first power pin to a first pad on a second face of the first die;
• coupling a second power pin to a first pad on a second face of the second die;
• bonding legs of a first saddle element to the first or the second conductive island so that the first saddle element extends at a distance therefrom, the first saddle element having a first power terminal and the legs extending from the first power terminal;
• and
• molding a package having a first main face, a second main face, a first side surface and a second side surface, so as to encapsulate the multilayer support, the first and the second dice, the first saddle element, the first and second power pins, with the dissipating plate flush with the second main face of the package, the first power terminal flush with the first main face of the package, the first power pin protruding from the first side surface of the package and the second power pin protruding from the second side surface of the package.

A device, comprising:

• a dissipating plate;
• an insulating layer on the dissipating plate;
• a conductive layer on the insulating layer, the conductive layer including a first island and a second island;
• a plurality of first dies on the first island;
• a plurality of second dies on the second island;
• a first clip element coupled to the plurality of first dies;
• a second clip element coupled to the plurality of second dies;
• a plurality of first power pins coupled to the first clip element;
• a plurality of second power pins coupled to the second clip element;
• a first saddle structure on the first clip element;
• a second saddle structure on the second clip element;
• and
• a package that includes the dissipating plate, insulating layer, the conductive layer, the plurality of first dies, the plurality of second dies, the first clip element, the second clip element, the first saddle structure, and the second saddle structure, a surface of the dissipating plate extending in an opening in a first surface of the package, surfaces of the first saddle structure and the second saddle structure extending in openings in a second surface of the package.