H10W 72/07655
Changes in materials
Official title: {changes in materials}
H10W72/07655 (Changes in materials) appears on 15 US grants and 21 published applications in this corpus.
Search patents in H10W- Granted patents
- 15
- Published applications
- 21
- Assignees
- 17
- Inventors
- 59
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 1 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 1 | 2 |
| 2015 | 2 | 0 |
| 2016 | 1 | 1 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 1 |
| 2020 | 0 | 2 |
| 2021 | 2 | 4 |
| 2022 | 1 | 0 |
| 2023 | 3 | 3 |
| 2024 | 1 | 2 |
| 2025 | 1 | 3 |
| 2026 | 2 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device26 May 2026US 12,642,107 B2Rohm Co., Ltd.
- Method of manufacturing semiconductor devices and corresponding semiconductor device27 Jan 2026US 12,538,809 B2STMicroelectronics S,r.l.
- Semiconductor package and related methods1 Jul 2025US 12,347,813 B2Semiconductor Components Industries, LLC
- Semiconductor device16 Jul 2024US 12,040,301 B2Rohm Co., Ltd.
- Semiconductor package and related methods28 Nov 2023US 11,830,856 B2Semiconductor Components Industries, LLC
- Package with Epitaxial Layer of Electronic Component Spaced from a Front-side Connection Body by less than 50 μm7 May 2026US 2026/0130235 A1
- Semiconductor package and related methods18 Sep 2025US 2025/0293213 A1Semiconductor Components Industries, LLC
- Semiconductor device4 Sep 2025US 2025/0279388 A1Kabushiki Kaisha Toshiba
- Clip27 Mar 2025US 2025/0105198 A1Nexperia B. V.
- Packaged transistor with channeled die attach materials and process of implementing the same7 Mar 2024US 2024/0079320 A1Wolfspeed, Inc.
Most cited
By later US patents
- Stacked dual-chip packaging structure and preparation method thereof8US 9,184,117 B2Alpha and Omega Semiconductor Incorporated · 2015
- Power semiconductor component stack using lead technology with surface-mountable external contacts and a method for producing the same7US 7,728,415 B2Infineon Technologies AG · 2010
- Optoelectronic component5US 8,742,448 B2OSRAM Opto Semiconductors GmbH · 2014
- Semiconductor package and related methods4US 11,830,856 B2Semiconductor Components Industries, LLC · 2023
- Integrated circuit having die attach materials with channels and process of implementing the same1US 11,424,177 B2Wolfspeed, Inc. · 2022