Packaged transistor with channeled die attach materials and process of implementing the same
AssigneeWolfspeed, Inc.
InventorsMitch FLOWERS, Erwin COHEN, Alexander KOMPOSCH, Larry Christopher WALL
Life of this patent
Estimating the term…
Abstract
A package includes a circuit that includes at least one active area and at least one secondary device area, a support configured to support the circuit, and a die attach material. The circuit being mounted on the support using the die attach material and the die attach material including at least one channel configured to allow gases generated during curing of the die attach material to be released from the die attach material.
Claims49
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A semiconductor device, comprising:
- a semiconductor die that comprises at least one secondary device area;
- a support;
- and
- a die attach material comprising at least one channel, at least a portion of the at least one channel positioned between the at least one secondary device area of the semiconductor die and the support to allow gases generated during attachment of the semiconductor die to the support to be released from the die attach material.
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A semiconductor device, comprising:
- a semiconductor die;
- a support;
- and
- a die attach material comprising at least one channel;
- and
- an over-mold configuration that at least surrounds the semiconductor die and the over-mold configuration is attached at least in part to the die attach material.
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Dependencies are inferred from the claim text.