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US 11,424,177 B2Granted
Integrated circuit having die attach materials with channels and process of implementing the same
AssigneeWolfspeed, Inc.
InventorsMitch Flowers, Erwin Cohen, Alexander Komposch
Life of this patent
Estimating the term…
Abstract
A package includes an integrated circuit that includes at least one active area and at least one secondary device area, a support configured to support the integrated circuit, and a die attach material. The integrated circuit being mounted on the support using the die attach material and the die attach material including at least one channel configured to allow gases generated during curing of the die attach material to be released from the die attach material.
Claims34
A package, comprising,
- a semiconductor die comprising at least one active area and at least one secondary device area;
- a support configured to support the semiconductor die;
- a die attach material;
- the semiconductor die being mounted on the support using the die attach material;
- and
- the die attach material including at least one channel,
- wherein the at least one channel is configured to allow gases generated during curing of the die attach material to be released from the die attach material;
- and
- wherein the at least one channel is located vertically below and laterally offset from the at least one active area.
6 more elements
A package, comprising,
- a semiconductor die comprising at least one active area and at least one secondary device area;
- a support configured to support the semiconductor die;
- a die attach material;
- the semiconductor die being mounted on the support using the die attach material;
- and
- the die attach material including at least one channel,
- wherein the at least one channel is configured to allow gases generated during curing of the die attach material to be released from the die attach material;
- wherein the at least one channel is configured to receive gases generated during curing from under the at least one active area, and once the gases are in the at least one channel, the at least one channel is configured to allow the gases to travel along the at least one channel and exit from the at least one channel through an exhaust vent;
- and
- wherein the at least one channel is located vertically below and laterally offset from the at least one active area.
7 more elements
A package, comprising,
- a semiconductor die comprising at least one active area and at least one secondary device area;
- a support configured to support the semiconductor die;
- a die attach material;
- the semiconductor die being mounted on the support using the die attach material;
- and
- the die attach material including at least one channel,
- wherein the at least one channel is configured to allow gases generated during curing of the die attach material to be released from the die attach material;
- wherein the at least one channel is configured to receive gases generated during curing from under the at least one active area, and once the gases are in the at least one channel, the at least one channel is configured to allow the gases to travel along the at least one channel and exit from the at least one channel through an exhaust vent;
- wherein a first implementation of the at least one channel is located vertically below and laterally offset from one side of the at least one active area and a second implementation of the at least one channel is located vertically below and laterally offset from another side of the at least one active area;
- and
- wherein the at least one channel includes at least one exhaust vent and at least one side edge.
8 more elements
A package, comprising,
- a semiconductor die comprising at least one active area and at least one secondary device area;
- a support configured to support the semiconductor die;
- a die attach material;
- the semiconductor die being mounted on the support using the die attach material;
- and
- the die attach material including at least one channel,
- wherein the at least one channel is configured to allow gases generated during curing of the die attach material to be released from the die attach material;
- wherein the at least one channel is arranged under the at least one secondary device area;
- and
- wherein the at least one channel is located vertically below and laterally offset from the at least one active area.
7 more elements
Dependencies are inferred from the claim text.