H10W 72/07653
Changes in shapes
Official title: {changes in shapes}
H10W72/07653 (Changes in shapes) appears on 694 US grants and 826 published applications in this corpus.
Search patents in H10W- Granted patents
- 694
- Published applications
- 826
- Assignees
- 197
- Inventors
- 1,128
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 4 | 3 |
| 2002 | 5 | 12 |
| 2003 | 12 | 6 |
| 2004 | 9 | 10 |
| 2005 | 7 | 16 |
| 2006 | 9 | 24 |
| 2007 | 7 | 38 |
| 2008 | 13 | 37 |
| 2009 | 20 | 31 |
| 2010 | 34 | 26 |
| 2011 | 34 | 41 |
| 2012 | 31 | 64 |
| 2013 | 58 | 61 |
| 2014 | 44 | 72 |
| 2015 | 76 | 68 |
| 2016 | 60 | 47 |
| 2017 | 46 | 31 |
| 2018 | 22 | 25 |
| 2019 | 26 | 26 |
| 2020 | 25 | 31 |
| 2021 | 30 | 44 |
| 2022 | 27 | 34 |
| 2023 | 24 | 26 |
| 2024 | 26 | 24 |
| 2025 | 16 | 19 |
| 2026 | 13 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of making a multi-chip package device6 Oct 2026US 12,757,800 B2Force Mos Technology Co., Ltd.
- Chip package with contact clip8 Sep 2026US 12,730,135 B2Infineon Technologies AG
- Semiconductor package and method for marking a semiconductor package14 Jul 2026US 12,685,179 B2Infineon Technologies Austria AG
- Isolated metal clips with structural bridge14 Jul 2026US 12,685,193 B2Analog Devices, Inc.
- Metal PCB for topside power delivery14 Jul 2026US 12,685,218 B2Intel Corporation
- Isolated metal clips with structural bridge8 Oct 2026US 2026/0314452 A1Analog Devices, Inc.
- Power semiconductor package having stacked fet dies and method for fabricating the same16 Jul 2026US 2026/0206634 A1
- Metal tab for power semiconductor module18 Jun 2026US 2026/0173950 A1Littelfuse, Inc.
- Semiconductor package having vertically stacked transistors and method of making the same28 May 2026US 2026/0150709 A1Alpha and Omega Semiconductor International LP
- Power module21 May 2026US 2026/0144039 A1Shinko Electric Industries Co., Ltd.
Most cited
By later US patents
- Self-centering electrode for power devices249US 4,935,803 AMotorola, Inc. · 1990
- Semiconductor package243US 6,040,626 AInternational Rectifier Corporation · 2000
- Symmetrical package for semiconductor die208US 6,256,200 B12001
- Ball grid array semiconductor package and substrate without power ring or ground ring191US 6,667,546 B2Siliconware Precision Industries Co., Ltd. · 2003
- Current sensor139US 7,598,601 B2Allegro MicroSystems, LLC · 2009