Semiconductor package and method for marking a semiconductor package
AssigneeInfineon Technologies Austria AG
InventorsHwee Yin Low, Badrus Hisham Abdul Rani, Wee Aun Jason Lim, Ai Yun Loh, Muhamad Hairul Fauzi Wahid
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Abstract
In an embodiment, a semiconductor package is provided that includes a first package surface and a second package surface opposing the first surface, a plastic molding and one or more semiconductor dies. The first package surface includes a first surface of the plastic molding and a first metallic area exposed from the plastic molding. The first metallic area includes a first product marking including at least one alphanumeric character and the first surface of the plastic molding includes a second product marking including at least one alphanumeric character.
Claims16
A semiconductor package, comprising:
- a first package surface and a second package surface opposing the first surface;
- a plastic molding;
- and
- a semiconductor die,
- wherein the first package surface comprises a first surface of the plastic molding and a first metallic area exposed from the plastic molding,
- wherein the first metallic area comprises a first product marking comprising at least one alphanumeric character and the first surface of the plastic molding comprises a second product marking comprising at least one alphanumeric character,
- wherein the first product marking and the second product marking include the same alphanumeric character or characters which provide the same information about the product and alone each provide the information about the product.
A method for marking a semiconductor package, the method comprising:
- providing a semiconductor package comprising a first package surface and a second package surface opposing the first package surface, a plastic molding, and a semiconductor die, wherein the first package surface comprises a first surface of the plastic molding and a first metallic area exposed from the plastic molding;
- forming a first product marking comprising at least one alphanumeric character in the first metallic area;
- and
- forming a second product marking comprising at least one alphanumeric character in the first surface of the plastic molding,
- wherein the first product marking and the second product marking include the same alphanumeric character or characters which provide the same information about the product and alone each provide the information about the product.
Dependencies are inferred from the claim text.