H10W 72/07627
Involving guiding structures
Official title: {involving guiding structures, e.g. spacers or supporting members}
H10W72/07627 (Involving guiding structures) appears on 50 US grants and 55 published applications in this corpus.
Search patents in H10W- Granted patents
- 50
- Published applications
- 55
- Assignees
- 28
- Inventors
- 126
- Latest grant
- 27 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2003 | 1 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 1 | 1 |
| 2007 | 0 | 0 |
| 2008 | 1 | 2 |
| 2009 | 1 | 2 |
| 2010 | 1 | 0 |
| 2011 | 2 | 0 |
| 2012 | 0 | 2 |
| 2013 | 3 | 3 |
| 2014 | 1 | 2 |
| 2015 | 3 | 2 |
| 2016 | 4 | 2 |
| 2017 | 1 | 3 |
| 2018 | 3 | 0 |
| 2019 | 1 | 7 |
| 2020 | 5 | 1 |
| 2021 | 5 | 9 |
| 2022 | 1 | 7 |
| 2023 | 7 | 4 |
| 2024 | 6 | 3 |
| 2025 | 2 | 2 |
| 2026 | 1 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing semiconductor devices and corresponding semiconductor device27 Jan 2026US 12,538,809 B2STMicroelectronics S,r.l.
- Semiconductor device package assemblies with direct leadframe attachment27 May 2025US 12,315,826 B2Semiconductor Components Industries, LLC
- Clip design and method of controlling clip position22 Apr 2025US 12,283,562 B2Semiconductor Components Industries, LLC
- Semiconductor module29 Oct 2024US 12,131,980 B2Fuji Electric Co., Ltd.
- Power module3 Sep 2024US 12,080,635 B2Wolfspeed, Inc.
- Device package with flexibly-aligned lead frame clip9 Apr 2026US 2026/0101773 A1Semiconductor Components Industries, LLC
- Clip design and method of controlling clip position31 Jul 2025US 2025/0246572 A1Semiconductor Components Industries, LLC
- Semiconductor device comprising a carrier, a semiconductor die and a c-shaped clip connected between them19 Jun 2025US 2025/0201754 A1Infineon Technologies AG
- Power Module28 Nov 2024US 2024/0395677 A1Wolfspeed, Inc.
- Clips with alignment features and related methods3 Oct 2024US 2024/0332145 A1Semiconductor Components Industries, LLC
Most cited
By later US patents
- Semiconductor packaging device comprising a semiconductor chip including a MOSFET67US 7,408,251 B2Renesas Technology Corp. · 2008
- Semiconductor device and a method of manufacturing the same44US 6,992,386 B2Renesas Technology Corp. · 2006
- Stacked leadframe implementation for DC/DC convertor power module incorporating a stacked controller and stacked leadframe construction methodology14US 8,450,149 B2Texas Instruments Incorporated · 2013
- Semiconductor packaging device comprising a semiconductor chip including a MOSFET13US 7,586,180 B2Renesas Technology Corp. · 2009
- Clip mount for integrated circuit leadframes13US 8,035,221 B2Intersil Americas Inc. · 2011