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US 2025/0201754 A1Published application
Semiconductor device comprising a carrier, a semiconductor die and a c-shaped clip connected between them
AssigneeInfineon Technologies AG
InventorsJoon Shyan TAN, Thai Kee GAN, Lee Shuang WANG, Azlina KASSIM, Hui Wen GOH, Mei Fen HIEW, Sin Fah YAP
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Abstract
A semiconductor device comprising a carrier, a semiconductor die disposed on the carrier and comprising a first contact pad on a first main face remote from the carrier, and a clip. The clip comprises a horizontal portion, a vertical portion, and a bent-back portion connected with the carrier.
Claims23
A semiconductor device comprising:
- a carrier;
- a semiconductor die disposed on the carrier and comprising a first contact pad on a first main face remote from the carrier;
- and
- a clip connected between the contact pad and the carrier, wherein the clip comprises a horizontal portion, a vertical portion, and a bent-back portion.
1 more element
A method for fabricating a semiconductor device, the method comprising
- providing a carrier;
- disposing a semiconductor die on the carrier, the semiconductor die comprising a first contact pad on a first main face remote from the carrier;
- providing a clip comprising a horizontal portion, a horizontal portion, an adjoining vertical portion, and an adjoining a bent-back portion connected with the carrier;
- and
- connecting the clip between the semiconductor die and the carrier by connecting the horizontal portion with the contact pad and the bent-back portion with the carrier.
2 more elements
Dependencies are inferred from the claim text.