Semiconductor device and a method of manufacturing the same

A semiconductor device comprising:

• a semiconductor chip including a MISFET;
• a source electrode of the MISFET formed on a bottom surface of the semiconductor chip;
• a gate electrode of the MISFET formed on a bottom surface of the semiconductor chip;
• a drain electrode formed on a top surface of the semiconductor chip;
• a drain electrode terminal positioned over the drain electrode and electrically connected with the drain electrode, the drain electrode terminal extending from over the top surface of the semiconductor chip to under the bottom surface of the semiconductor chip;
• a source electrode terminal positioned under the source electrode and electrically connected with the source electrode;
• a gate electrode terminal positioned under the source electrode and electrically connected with the gate electrode;
• and
• a sealing member sealing the semiconductor chip and parts of the drain, source and gate electrode terminals,
• wherein the source and gate electrode terminals are exposed from a bottom surface of the sealing member,
• the drain electrode terminal are exposed from a top surface and the bottom surface to the sealing member,
• the sealing member has a first side face, a second side face, a third side face and a fourth side face,
• the first and second side faces are opposite each other, and the third and fourth side faces are opposite each other,
• the first side surface of the sealing member connects to the third and fourth side faces of the sealing member, and the second side surface of the sealing member connects to the third and fourth side faces of the sealing member,
• the source and gate electrode terminals are exposed from the first and second side faces of the sealing member, and
• the drain electrode terminal is exposed from the third and fourth side faces of the sealing member.