Semiconductor module
AssigneeFuji Electric Co., Ltd.
InventorsToru Yamada, Takafumi Yamada
Life of this patent
Estimating the term…
Abstract
A semiconductor module includes a semiconductor device having a gate runner extending in a first direction at an upper surface of the semiconductor device, and a metal wiring plate having a first bonding portion with a bonding surface to which the upper surface of the semiconductor device is bonded via a first bonding material. The first bonding portion has a plurality of first protrusions at the bonding surface. Each first protrusion protrudes toward the semiconductor device, and is provided in a position away from the gate runner by a first distance in a plan view of the semiconductor module.
Claims24
A semiconductor module, comprising:
- a semiconductor device having a gate runner extending in a first direction at an upper surface of the semiconductor device, the semiconductor device further including an upper surface electrode provided on the upper surface thereof and a plating layer provided on an upper surface of the upper surface electrode;
- and
- a metal wiring plate having a first bonding portion with a bonding surface to which the upper surface of the semiconductor device is bonded via a first bonding material, wherein
- the first bonding portion has a plurality of first protrusions at the bonding surface, each first protrusion protruding toward the semiconductor device, and
- each first protrusion is provided at a position separated from a boundary portion in which the gate runner and the plating layer are gathered by a first distance in a plan view of the semiconductor module.
Dependencies are inferred from the claim text.