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US 2026/0101773 A1Published application
Device package with flexibly-aligned lead frame clip
AssigneeSemiconductor Components Industries, LLC
InventorsNanNan CHEN, XiaoYing YUAN, Jie CHANG, Keunhyuk LEE
Life of this patent
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Abstract
A package includes a semiconductor die disposed on a lead frame. A source contact pad is disposed on the semiconductor die. The package further includes a lead post shared by a plurality of leads that form external terminals of the package. The lead post has a clip-locking feature. A clip connects the source contact pad to the lead post. The clip has a key structure coupled to the clip-locking feature in the lead post.
Claims21
A package comprising:
- a semiconductor die disposed on a lead frame;
- a source contact pad disposed on the semiconductor die;
- a lead post shared by a plurality of leads that form external terminals of the package, the lead post having a clip-locking feature;
- and
- a clip connecting the source contact pad to the lead post, the clip having a key structure coupled to the clip-locking feature in the lead post.
2 more elements
A package comprising:
- a semiconductor die disposed at a variable location on a paddle in a lead frame, the semiconductor die including a source contact pad;
- and
- a clip connecting the source contact pad to a lead post of the lead frame forming an external terminal of the package, the clip being aligned relative to the variable location of the semiconductor die on the paddle and the lead post.
A method comprising:
- disposing a semiconductor die at a variable location on a paddle in a lead frame, the semiconductor die including a source contact pad;
- and
- aligning a clip to connect a lead post of the lead frame to the source contact pad on the semiconductor die disposed at the variable location on the paddle.
Dependencies are inferred from the claim text.