H10W 70/641
Adaptable interconnections
Official title: {Adaptable interconnections, e.g. fuses or antifuses}
H10W70/641 (Adaptable interconnections) appears on 473 US grants and 339 published applications in this corpus.
Search patents in H10W- Granted patents
- 473
- Published applications
- 339
- Assignees
- 176
- Inventors
- 834
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 7 | 0 |
| 1988 | 6 | 0 |
| 1989 | 5 | 0 |
| 1990 | 3 | 0 |
| 1991 | 7 | 0 |
| 1992 | 5 | 0 |
| 1993 | 10 | 0 |
| 1994 | 6 | 0 |
| 1995 | 10 | 0 |
| 1996 | 10 | 0 |
| 1997 | 11 | 0 |
| 1998 | 19 | 0 |
| 1999 | 20 | 0 |
| 2000 | 22 | 0 |
| 2001 | 14 | 5 |
| 2002 | 17 | 25 |
| 2003 | 13 | 11 |
| 2004 | 16 | 14 |
| 2005 | 17 | 10 |
| 2006 | 12 | 21 |
| 2007 | 9 | 14 |
| 2008 | 13 | 16 |
| 2009 | 14 | 13 |
| 2010 | 13 | 12 |
| 2011 | 11 | 9 |
| 2012 | 10 | 12 |
| 2013 | 14 | 10 |
| 2014 | 10 | 11 |
| 2015 | 12 | 12 |
| 2016 | 11 | 14 |
| 2017 | 16 | 14 |
| 2018 | 15 | 12 |
| 2019 | 13 | 14 |
| 2020 | 13 | 16 |
| 2021 | 12 | 7 |
| 2022 | 12 | 18 |
| 2023 | 4 | 11 |
| 2024 | 15 | 16 |
| 2025 | 8 | 14 |
| 2026 | 10 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for configuring multiple input-output channels14 Jul 2026US 12,682,936 B2Micron Technology, Inc.
- Semiconductor assemblies with systems and methods for using an interchangeable interposer to connect die to common substrate7 Jul 2026US 12,677,678 B2Micron Technology, Inc.
- Semiconductor device assemblies with cavity-embedded cubes and logic-supporting interposers23 Jun 2026US 12,666,988 B2Micron Technology, Inc.
- Power semiconductor module, method for manufacturing the same and electrical converter5 May 2026US 12,622,227 B2Hitachi Energy Ltd
- Electronic device having a plurality of chiplets10 Mar 2026US 12,572,493 B2Rebellions Inc.
- Semiconductor device assemblies with cavity-embedded cubes and logic-supporting interposers8 Oct 2026US 2026/0314455 A1Micron Technology, Inc.
- Electronic device having a plurality of chiplets18 Jun 2026US 2026/0169945 A1Rebellions Inc.
- Signal routing structures including a plurality of parallel conductive lines and semiconductor device assemblies including the same4 Jun 2026US 2026/0157204 A1Micron Technology, Inc.
- Bonded structure with connecting element30 Apr 2026US 2026/0123471 A1Adeia Semiconductor Bonding Technologies Inc.
- Multi-chiplet semiconductor device with redundant data line23 Apr 2026US 2026/0114299 A1Silicon Storage Technology, Inc.
Most cited
By later US patents
- Multiprocessor module packaging375US 5,391,917 AInternational Business Machines Corporation · 1995
- Parallel process interposer (PPI)263US 5,404,044 AInternational Business Machines Corporation · 1995
- Semiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuit261US 5,502,333 AInternational Business Machines Corporation · 1996
- Process for interconnecting conductive substrates using an interposer having conductive plastic filled vias220US 5,468,681 ALSI Logic Corporation · 1995
- Programmable interposer circuitry161US 9,106,229 B1Altera Corporation · 2015