Electronic device having a plurality of chiplets
AssigneeRebellions Inc.
InventorsYoung-Jae Jin, Miock Chi
Life of this patent
Estimating the term…
Abstract
Provided is an electronic device, including a first chiplet including a system bus, a first interconnect module, and a second interconnect module, and a second chiplet connected to the first chiplet through at least one of a first interconnect interface connected to the first interconnect module or second interconnect interface connected to the second interconnect module, in which, in response to determining that a communication failure occurs between the first chiplet and the second chiplet, at least a part of a transfer path through which information is transmitted from the first chiplet to the second chiplet is changed.
Claims9
An electronic device, comprising:
- a first chiplet comprising a system bus, a first interconnect module, and a second interconnect module;
- a second chiplet connected to the first chiplet through at least one of a first interconnect interface connected to the first interconnect module or a second interconnect interface connected to the second interconnect module;
- and
- the system bus comprises a switch logic comprising a first logic, wherein
- in response to determining that a communication failure occurs between the first chiplet and the second chiplet, the switch logic is activated to change at least a part of a transfer path through which information is transmitted from the first chiplet to the second chiplet, wherein the first logic is activated in response to determining that a disconnection occurs in at least one path of the transfer path coupled to the switch logic between the first chiplet and the second chiplet, wherein the first logic couples the first chiplet to the second chiplet on at least one alternative path between the first chiplet and the second chiplet of the transfer path based on determining that the disconnection occurs.
Dependencies are inferred from the claim text.