H10W 70/467
Multilayered additional interconnections
Official title: {Multilayered additional interconnections}
H10W70/467 (Multilayered additional interconnections) appears on 131 US grants and 120 published applications in this corpus.
Search patents in H10W- Granted patents
- 131
- Published applications
- 120
- Assignees
- 64
- Inventors
- 267
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 4 | 0 |
| 1992 | 1 | 0 |
| 1993 | 10 | 0 |
| 1994 | 4 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 0 | 0 |
| 1998 | 4 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 2 |
| 2003 | 1 | 1 |
| 2004 | 1 | 2 |
| 2005 | 0 | 1 |
| 2006 | 1 | 3 |
| 2007 | 2 | 0 |
| 2008 | 1 | 1 |
| 2009 | 1 | 2 |
| 2010 | 2 | 0 |
| 2011 | 1 | 2 |
| 2012 | 1 | 1 |
| 2013 | 2 | 5 |
| 2014 | 1 | 3 |
| 2015 | 7 | 10 |
| 2016 | 9 | 3 |
| 2017 | 6 | 11 |
| 2018 | 11 | 8 |
| 2019 | 3 | 6 |
| 2020 | 8 | 12 |
| 2021 | 13 | 8 |
| 2022 | 4 | 7 |
| 2023 | 6 | 7 |
| 2024 | 6 | 12 |
| 2025 | 5 | 7 |
| 2026 | 4 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor module6 Oct 2026US 12,757,754 B2Denso Corporation
- Power semiconductor device and manufacturing method8 Sep 2026US 12,733,493 B2Hitachi Energy Ltd
- Packaged high voltage MOSFET device with connection clip and manufacturing process thereof21 Apr 2026US 12,610,832 B2STMicroelectronics S,r.l.
- Method of coupling semiconductor dice and corresponding semiconductor device13 Jan 2026US 12,525,512 B2STMicroelectronics S,r.l.
- Method of coupling semiconductor dice, tool for use therein and corresponding semiconductor device16 Dec 2025US 12,500,148 B2STMicroelectronics S,r.l.
- Connection board for flash memory chip and preparation method therefor, and flash memory chip27 Aug 2026US 2026/0256032 A1Gigadevice Semiconductor (Xian) Inc.
- Semiconductor device16 Jul 2026US 2026/0206636 A1Rohm Co., Ltd.
- Method of manufacturing a semiconductor package and such semiconductor package18 Jun 2026US 2026/0173938 A1Nexperia B. V.
- Semiconductor package structure4 Jun 2026US 2026/0157193 A1Panjit Semiconductor (Xuzhou) Co., Ltd
- Semiconductor device21 May 2026US 2026/0144127 A1Rohm Co., Ltd.
Most cited
By later US patents
- Metal plane support for multi-layer lead frames and a process for manufacturing such frames190US 5,410,180 AIntel Corporation · 1995
- Multilayered lead frame for semiconductor package150US 6,153,924 AMicron Technology, Inc. · 2000
- Multi-layer molded plastic IC package141US 4,891,687 AIntel Corporation · 1990
- Composite lead frame and semiconductor device using the same124US 5,227,662 ANippon Steel Corporation · 1993
- Ground plane for plastic encapsulated integrated circuit die packages96US 5,068,708 AAdvanced Micro Devices, Inc. · 1991