Composite lead frame and semiconductor device using the same

A semiconductor device comprising:

• a semiconductor chip,
• a lead frame having a plurality of first lead fingers,
• a plurality of second lead fingers supported on a film member having a device hole for accepting the semiconductor chip, wherein the first lead fingers are bonded to corresponding second lead fingers, and wherein the semiconductor chip is connected to the second lead fingers through bonding wires,
• a pad for mounting the semiconductor chip, and for serving as a heat sink for the semiconductor chip,
• bonding means for bonding the pad to the first lead fingers on a side of said first lead fingers opposite to that on which the second lead fingers are bonded, and for providing an, electrical insulation between the pad and the first lead fingers and
• a sealing member for sealing the semiconductor chip, the second lead fingers, bonded portions between the first lead fingers and the second lead fingers, and at least part of the pad.

A composite lead frame to which a semiconductor chip is bonded, comprising:

• a pad for mounting said semiconductor chip thereto and for serving as a heat sink for said chip;
• bonding means disposed on said pad;
• a lead frame having a plurality of first leads, said first leads each having an inner end disposed on said bonding means;
• a film member disposed on said bonding means in a manner so as to be separate from the inner ends of said first leads;
• and
• a plurality of second leads disposed on said film member and extending to said inner ends, wherein said second leads are bonded to corresponding ones of said first leads;
• wherein said bonding means connects the pad to the first leads on a first side of said first leads opposite to a second side of said first leads to which the second leads are bonded.