US 2026/0157193 A1Published application

Semiconductor package structure

AssigneePanjit Semiconductor (Xuzhou) Co., Ltd

InventorsTing Yu FANG, Bing WEI, Cuifeng WAN, Chung Hsiung HO, Yung-hui WANG, Jeng Sian WU

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Abstract

A semiconductor package structure including a lead frame, a die, first and second electrical connection components and an encapsulation layer. The lead frame includes a supporting part and a circuit part spaced apart from each other. The die is disposed on the supporting part of the lead frame and electrically connected to the circuit part of the lead frame. The first electrical connection component includes a conductive adhesive disposed on and electrically connected to the circuit part of the lead frame. The second electrical connection component includes a conductive adhesive disposed on and electrically connected to the supporting part of the lead frame. The encapsulation layer surrounds the die. The conductive adhesives are disposed in the encapsulation layer. Opposite two lateral surfaces of the encapsulation layer expose the conductive adhesives, respectively.

Claims20

Dependent claims

A semiconductor package structure, comprising:

a lead frame, comprising a supporting part and a circuit part spaced apart from each other;
a die, disposed on the supporting part of the lead frame and electrically connected to the circuit part of the lead frame;
a first electrical connection component, comprising a conductive adhesive disposed on and electrically connected to the circuit part of the lead frame;
a second electrical connection component, comprising a conductive adhesive disposed on and electrically connected to the supporting part of the lead frame;
and
an encapsulation layer, surrounding the die, wherein the conductive adhesive of the first electrical connection component and the conductive adhesive of the second electrical connection component are disposed in the encapsulation layer, and opposite two lateral surfaces of the encapsulation layer expose the conductive adhesive of the first electrical connection component and the conductive adhesive of the second electrical connection component, respectively.

3 more elements

Dependencies are inferred from the claim text.