Method of coupling semiconductor dice and corresponding semiconductor device

A method, comprising:

• arranging a first semiconductor die and a second semiconductor die on a substrate;
• molding an encapsulation of laser direct structuring (LDS) material onto the first semiconductor die and the second semiconductor die arranged on the substrate, the encapsulation of LDS material having a surface opposite the substrate;
• providing at least one electrically conductive die-to-die coupling formation between the first semiconductor die and the second semiconductor die, the at least one die-to-die coupling formation comprising:
• die vias extending through the LDS material between the surface of the encapsulation of LDS material opposite the substrate and the first semiconductor die and the second semiconductor die;
• and a die-to-die line extending at the surface of the encapsulation of LDS material opposite the substrate and coupling said die vias;
• wherein providing said at least one electrically conductive die-to-die coupling formation comprises:
• applying laser beam energy to selected locations of the surface of the encapsulation of LDS material opposite the substrate to laser activate and structure said die vias and said die-to-die line in the encapsulation of LDS material;
• and
• applying laser-induced forward transfer (LIFT) processing to transfer electrically conductive material onto said die vias and said die-to-die line extending between the die vias.