Method of coupling semiconductor dice, tool for use therein and corresponding semiconductor device

A method, comprising:

• arranging a first semiconductor die and a second semiconductor die on a substrate;
• molding an encapsulation of laser direct structuring (LDS) material onto the first semiconductor die and the second semiconductor die arranged on the substrate, the encapsulation of LDS material having a surface opposite the substrate;
• providing at least one electrically conductive die-to-die coupling formation between the first semiconductor die and the second semiconductor die, the at least one die-to-die coupling formation comprising:
• die vias extending through the LDS material between the surface of the encapsulation of LDS material opposite the substrate and each of the first semiconductor die and the second semiconductor die and a die-to-die line extending at the surface of the encapsulation of LDS material opposite the substrate and coupling said die vias;
• wherein providing said at least one electrically conductive die-to-die coupling formation comprises:
• applying laser beam energy to selected locations of the surface of the encapsulation of LDS material opposite the substrate to laser activate the LDS material and structure therein said die vias and said die-to-die line;
• placing said selected locations of the surface of the encapsulation of LDS material opposite the substrate that are laser activated and structured into contact with an electrode wherein the electrode provides an electrically conductive path to said selected locations;
• and
• electrolytically growing metal material onto said selected locations of the surface of the encapsulation of LDS material that are laser activated and structured, wherein electrolytically growing metal material comprises exposing said selected locations to an electrolyte carrying cations of metal material and reducing said cations to metal material via a current flowing through the electrically conductive path provided via said electrode.