H10W 46/601
Marks applied to devices: for use after dicing
Official title: {for use after dicing}
H10W46/601 (Marks applied to devices: for use after dicing) appears on 2,138 US grants and 2,290 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,138
- Published applications
- 2,290
- Assignees
- 623
- Inventors
- 4,240
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 4 | 0 |
| 1982 | 3 | 0 |
| 1983 | 3 | 0 |
| 1984 | 5 | 0 |
| 1985 | 4 | 0 |
| 1986 | 4 | 0 |
| 1987 | 5 | 0 |
| 1988 | 4 | 0 |
| 1989 | 3 | 0 |
| 1990 | 7 | 0 |
| 1991 | 9 | 0 |
| 1992 | 7 | 0 |
| 1993 | 9 | 0 |
| 1994 | 13 | 0 |
| 1995 | 23 | 0 |
| 1996 | 14 | 0 |
| 1997 | 10 | 0 |
| 1998 | 24 | 0 |
| 1999 | 31 | 0 |
| 2000 | 44 | 0 |
| 2001 | 48 | 23 |
| 2002 | 68 | 66 |
| 2003 | 61 | 91 |
| 2004 | 71 | 93 |
| 2005 | 60 | 93 |
| 2006 | 82 | 82 |
| 2007 | 56 | 79 |
| 2008 | 44 | 65 |
| 2009 | 44 | 87 |
| 2010 | 70 | 65 |
| 2011 | 82 | 85 |
| 2012 | 54 | 67 |
| 2013 | 76 | 74 |
| 2014 | 72 | 87 |
| 2015 | 83 | 108 |
| 2016 | 95 | 126 |
| 2017 | 107 | 109 |
| 2018 | 97 | 98 |
| 2019 | 97 | 104 |
| 2020 | 81 | 96 |
| 2021 | 87 | 111 |
| 2022 | 82 | 100 |
| 2023 | 70 | 112 |
| 2024 | 90 | 123 |
| 2025 | 88 | 90 |
| 2026 | 45 | 56 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method of forming ferroelectric chiplet in a multi-dimensional packaging with I/O switch embedded in a substrate or interposer25 Aug 2026US 12,717,479 B2Kepler Computing Inc.
- Self-alignment of glass core halves using protruded bumps25 Aug 2026US 12,721,193 B2Intel Corporation
- First chip and wafer bonding method and chip stacking structure18 Aug 2026US 12,713,934 B2Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Substrate barcode readability enhancement structures and method11 Aug 2026US 12,707,984 B2Infineon Technologies AG
- Electronic component device4 Aug 2026US 12,701,815 B2Olympus Medical Systems Corp.
- Semiconductor package with alignment marks1 Oct 2026US 2026/0305371 A1Samsung Electronics Co., Ltd.
- Display device and method of manufacturing the same24 Sep 2026US 2026/0293498 A1Samsung Display Co., Ltd.
- Semiconductor package17 Sep 2026US 2026/0282939 A1Samsung Electronics Co., Ltd.
- Semiconductor package and method for fabricating the same13 Aug 2026US 2026/0239993 A1Samsung Electronics Co., Ltd.
- Interposer substrate and semiconductor package including the same13 Aug 2026US 2026/0239994 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices775US 7,157,787 B2Intel Corporation · 2007
- Method and apparatus for generating a device ID for stacked devices631US 7,111,149 B2Intel Corporation · 2006
- Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices528US 6,762,076 B2Intel Corporation · 2004
- Semiconductor package and method thereof328US 5,776,798 AMotorola, Inc. · 1998
- Semiconductor package and method for fabricating the same314US 6,395,578 B1Amkor Technology, Inc. · 2002