Self-alignment of glass core halves using protruded bumps
AssigneeIntel Corporation
InventorsBrandon C. Marin, Sashi S. Kandanur, Suddhasattwa Nad, Srinivas V. Pietambaram, Gang Duan, Jeremy D. Ecton
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Abstract
Embodiments disclosed herein include cores for package substrates. In an embodiment, the core comprises a first substrate, where the first substrate comprises glass. In an embodiment, the core further comprises a first through glass via (TGV) through the first substrate and a second substrate, where the second substrate comprises glass. In an embodiment, the core further comprises a second TGV through the second substrate, where the first TGV is aligned with the second TGV.
Claims11
A core for a package substrate, comprising:
- a first substrate, wherein the first substrate comprises glass;
- a first through glass via (TGV) through the first substrate, wherein the first TGV extends past a surface of the first substrate;
- a second substrate having a surface coupled to the surface of the first substrate, wherein the second substrate comprises glass;
- and
- a second TGV through the second substrate, wherein the second TGV is recessed from the surface of the second substrate, wherein the first TGV extends into the second substrate and is aligned and in contact with the second TGV.
An electronic package, comprising:
- a core, wherein the core comprises:
- a first sub-layer and a second sub-layer, the second sub-layer having a surface coupled to a surface of the first sub-layer;
- and
- first TGVs through the first sub-layer and second TGVs through the second sub-layer, wherein the first TGVs extend past the surface of the first sub-layer, wherein the second TGVs are recessed from the surface of the second sub-layer, wherein the first TGVs extend into the second sub-layer and are aligned with, and bonded to, the second TGVs;
- a first buildup layer over the core;
- and
- a second buildup layer under the core.
Dependencies are inferred from the claim text.