H10W 46/103
Alphanumeric information
Official title: {alphanumeric information, e.g. words, letters or serial numbers}
H10W46/103 (Alphanumeric information) appears on 439 US grants and 494 published applications in this corpus.
Search patents in H10W- Granted patents
- 439
- Published applications
- 494
- Assignees
- 202
- Inventors
- 1,084
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 7 | 0 |
| 1997 | 4 | 0 |
| 1998 | 2 | 0 |
| 1999 | 6 | 0 |
| 2000 | 12 | 0 |
| 2001 | 12 | 8 |
| 2002 | 14 | 14 |
| 2003 | 18 | 25 |
| 2004 | 18 | 19 |
| 2005 | 17 | 22 |
| 2006 | 15 | 15 |
| 2007 | 9 | 16 |
| 2008 | 6 | 17 |
| 2009 | 10 | 9 |
| 2010 | 11 | 14 |
| 2011 | 7 | 22 |
| 2012 | 13 | 24 |
| 2013 | 18 | 16 |
| 2014 | 16 | 18 |
| 2015 | 21 | 28 |
| 2016 | 24 | 32 |
| 2017 | 25 | 26 |
| 2018 | 22 | 18 |
| 2019 | 15 | 18 |
| 2020 | 19 | 24 |
| 2021 | 15 | 17 |
| 2022 | 13 | 11 |
| 2023 | 11 | 23 |
| 2024 | 16 | 25 |
| 2025 | 14 | 17 |
| 2026 | 13 | 16 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- UV-curable resin compositions suitable for redistribution layers25 Aug 2026US 12,717,232 B2Designer Molecules, Inc.
- Method of marking semiconductor package4 Aug 2026US 12,702,018 B2Samsung Electronics Co., Ltd.
- Semiconductor package4 Aug 2026US 12,702,019 B2Samsung Electronics Co., Ltd.
- Semiconductor package and method for marking a semiconductor package14 Jul 2026US 12,685,179 B2Infineon Technologies Austria AG
- Semiconductor package9 Jun 2026US 12,653,035 B2Samsung Electronics Co., Ltd.
- Integrated device package with reduced thickness17 Sep 2026US 2026/0282305 A1Skyworks Solutions, Inc.
- Semiconductor package17 Sep 2026US 2026/0282939 A1Samsung Electronics Co., Ltd.
- Method of optimizing laser marking path6 Aug 2026US 2026/0231778 A1Samsung Electronics Co., Ltd.
- Semiconductor device, method of manufacturing semiconductor device, semiconductor inspection apparatus, and semiconductor device inspection jig23 Jul 2026US 2026/0215289 A1Mitsubishi Electric Corporation
- Die Labelling for Semiconductor Die9 Jul 2026US 2026/0198331 A1Wolfspeed, Inc.
Most cited
By later US patents
- Semiconductor wafer267US 6,864,534 B2Renesas Technology Corp. · 2005
- Semiconductor wafer marking for identification during processing119US 5,175,774 AMicron Technology, Inc. · 1992
- Semiconductor device having identification region for carrying out failure analysis113US 5,294,812 AKabushiki Kaisha Toshiba · 1994
- Optical character recognition illumination method and system68US 5,515,452 AElectroglas, Inc. · 1996
- Flip chip in leaded molded package and method of manufacture thereof68US 6,720,642 B1Fairchild Semiconductor Corporation · 2004