UV-curable resin compositions suitable for redistribution layers
AssigneeDesigner Molecules, Inc.
InventorFarhad Mizori
Life of this patent
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Abstract
Hydrophobic, tough, photoimageable, functionalized polyimide formulations have been discovered that can be UV cured and developed in cyclopentanone. The present invention formulations can be used as passivation and redistribution layers with patterning provided by photolithograph, for the redistribution of I/O pads on fan-out RDL applications. The curable polyimide formulations reduce stress on thin wafers, when compared to conventional polyimide formulations, and provide low modulus, hydrophobic solder mask. These materials can serve as protective layers in any applications in which a thin, flexible, and hydrophobic polymer is required, that also has high tensile strength and high elongation at break.
Claims18
A passivating formulation comprising a mixture of at least one first curable, functionalized polyimide and at least one second curable, functionalized polyimide which said polyimides are the products of a condensation reaction of a diamine with an anhydride and are selected from the group consisting of
- wherein in each of Compounds 1 and 2 n is an integer having the value 1 to 10, and in each of Compounds 3-6, each of n and m is an integer independently having the value 1 to 50, with the further proviso that the at least one first curable, functionalized, flexible polyimide is selected from the group consisting of Compound 1, Compound 2, and combinations thereof, and the at least one second curable, functionalized polyimide is selected from the group consisting of Compound 3, Compound 4, Compound 5, Compound 6, and combinations thereof.
Dependencies are inferred from the claim text.