Die Labelling for Semiconductor Die
AssigneeWolfspeed, Inc.
InventorsChandrasekhar Sarma, William Donald Hughes, Evan Robinson
Life of this patent
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Abstract
One example embodiment is directed to a semiconductor die. The semiconductor die includes a semiconductor structure, the semiconductor structure including a portion of a semiconductor wafer. The semiconductor die includes a die label, the die label indicative of a fabrication position of the semiconductor die on the semiconductor wafer. The die label has a first portion identifying a location of the semiconductor die within a reticle field and a second portion identifying a location of the reticle field on the semiconductor wafer. The semiconductor wafer includes two or more reticle fields.
Claims20
A semiconductor die, comprising:
- a semiconductor structure, the semiconductor structure comprising a portion of a semiconductor wafer;
- wherein the semiconductor die comprises a die label, the die label indicative of a fabrication position of the semiconductor die on the semiconductor wafer;
- and
- wherein the die label has a first portion identifying a location of the semiconductor die within a reticle field and a second portion identifying a location of the reticle field on the semiconductor wafer, wherein the semiconductor wafer comprises two or more reticle fields.
A method of providing a die label as part of each of a plurality of semiconductor die, the method comprising:
- for each reticle field of a plurality of reticle fields for a semiconductor wafer, exposing the semiconductor wafer with a first mask,
- for each reticle field of the plurality of reticle fields, exposing the semiconductor wafer with a second mask at an offset relative to the first mask to provide an indicator on each of a plurality of semiconductor die within the reticle field, the indicator providing a position of the reticle field on the semiconductor wafer.
A semiconductor wafer, comprising:
- a plurality of semiconductor die, the plurality of semiconductor die arranged in a plurality of reticle fields on the semiconductor wafer, each reticle field associated with an exposure of a mask on the semiconductor wafer;
- and
- wherein each of the plurality of semiconductor die comprises a unique die label, wherein the unique die label comprises an indicator indicative of a position of one of the plurality of reticle fields on the semiconductor wafer.
Dependencies are inferred from the claim text.