H10W 46/101
Marks applied to devices: characterised by the type of information
Official title: {characterised by the type of information, e.g. logos or symbols}
H10W46/101 (Marks applied to devices: characterised by the type of information) appears on 1,654 US grants and 1,822 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,654
- Published applications
- 1,822
- Assignees
- 470
- Inventors
- 3,502
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 3 | 0 |
| 1988 | 6 | 0 |
| 1989 | 2 | 0 |
| 1990 | 4 | 0 |
| 1991 | 0 | 0 |
| 1992 | 4 | 0 |
| 1993 | 4 | 0 |
| 1994 | 6 | 0 |
| 1995 | 7 | 0 |
| 1996 | 11 | 0 |
| 1997 | 9 | 0 |
| 1998 | 10 | 0 |
| 1999 | 35 | 0 |
| 2000 | 31 | 0 |
| 2001 | 36 | 16 |
| 2002 | 33 | 41 |
| 2003 | 50 | 56 |
| 2004 | 37 | 52 |
| 2005 | 38 | 63 |
| 2006 | 55 | 58 |
| 2007 | 40 | 57 |
| 2008 | 26 | 38 |
| 2009 | 30 | 49 |
| 2010 | 37 | 44 |
| 2011 | 43 | 57 |
| 2012 | 43 | 62 |
| 2013 | 51 | 64 |
| 2014 | 62 | 70 |
| 2015 | 78 | 96 |
| 2016 | 84 | 100 |
| 2017 | 98 | 97 |
| 2018 | 99 | 109 |
| 2019 | 92 | 100 |
| 2020 | 83 | 84 |
| 2021 | 75 | 102 |
| 2022 | 74 | 93 |
| 2023 | 60 | 104 |
| 2024 | 74 | 87 |
| 2025 | 70 | 84 |
| 2026 | 44 | 39 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- UV-curable resin compositions suitable for redistribution layers25 Aug 2026US 12,717,232 B2Designer Molecules, Inc.
- Method of manufacturing silicon carbide substrate, silicon carbide single-crystal substrate and silicon carbide semiconductor device25 Aug 2026US 12,720,830 B2Denso Corporation
- Substrate barcode readability enhancement structures and method11 Aug 2026US 12,707,984 B2Infineon Technologies AG
- Semiconductor device and semiconductor chip4 Aug 2026US 12,702,017 B2Samsung Electronics Co., Ltd.
- Method of marking semiconductor package4 Aug 2026US 12,702,018 B2Samsung Electronics Co., Ltd.
- Display device and method of manufacturing the same24 Sep 2026US 2026/0293498 A1Samsung Display Co., Ltd.
- Alignment Structure for Image Sensor24 Sep 2026US 2026/0293697 A1OmniVision Technologies, Inc.
- Integrated device package with reduced thickness17 Sep 2026US 2026/0282305 A1Skyworks Solutions, Inc.
- Semiconductor package17 Sep 2026US 2026/0282939 A1Samsung Electronics Co., Ltd.
- Semiconductor device and manufacturing method thereof20 Aug 2026US 2026/0247988 A1Kioxia Corporation
Most cited
By later US patents
- Semiconductor wafer edge marking561US 6,710,364 B2Texas Instruments Incorporated · 2004
- Method of recovering alignment marks after chemical mechanical polishing of tungsten276US 6,020,263 ATaiwan Semiconductor Manufacturing Company.Ltd · 2000
- Alignment of MTJ stack to conductive lines in the absence of topography273US 7,223,612 B2Infineon Technologies AG · 2007
- Semiconductor wafer267US 6,864,534 B2Renesas Technology Corp. · 2005
- Semiconductor package for three-dimensional mounting, fabrication method thereof, and semiconductor device234US 6,740,964 B2Oki Electric Industry Co., Ltd. · 2004