H10W 20/455
Thin functional dielectric layers
Official title: {Thin functional dielectric layers}
H10W20/455 (Thin functional dielectric layers) appears on 6 US grants and 20 published applications in this corpus.
Search patents in H10W- Granted patents
- 6
- Published applications
- 20
- Assignees
- 11
- Inventors
- 49
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2023 | 0 | 4 |
| 2024 | 0 | 1 |
| 2025 | 0 | 5 |
| 2026 | 6 | 10 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device11 Aug 2026US 12,707,945 B2Samsung Electronics Co., Ltd.
- Integrated circuit devices including metal structures having a curved interface and methods of forming the same11 Aug 2026US 12,707,946 B2Samsung Electronics Co., Ltd.
- Selective barrier layer deposition using blocking layers16 Jun 2026US 12,660,580 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of forming semiconductor structure and semiconductor structure9 Jun 2026US 12,653,025 B2Changxin Memory Technologies, Inc.
- Interconnects with sidewall barrier layer divot fill5 May 2026US 12,622,248 B2International Business Machines Corporation
- Semiconductor structure including a bit line structure and method of manufacturing the same24 Sep 2026US 2026/0293116 A1Nanya Technology Corporation
- Interconnection structure and methods of forming the same24 Sep 2026US 2026/0293631 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Chip, method for manufacturing chip, and electronic device17 Sep 2026US 2026/0282499 A1Huawei Technologies Co., Ltd.
- Method of forming semiconductor structure and semiconductor structure17 Sep 2026US 2026/0282889 A1Changxin Memory Technologies, Inc.
- Method for manufacturing thin film transistor, sputtering target, and sintered body3 Sep 2026US 2026/0262239 A1Kobelco Research Institute, Inc.
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.