H10W 20/0888
Wherein via-level dielectrics are compositionally different than trench-level dielectrics
Official title: {wherein via-level dielectrics are compositionally different than trench-level dielectrics}
H10W20/0888 (Wherein via-level dielectrics are compositionally different than trench-level dielectrics) appears on 223 US grants and 190 published applications in this corpus.
Search patents in H10W- Granted patents
- 223
- Published applications
- 190
- Assignees
- 81
- Inventors
- 419
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 3 | 0 |
| 1998 | 3 | 0 |
| 1999 | 4 | 0 |
| 2000 | 9 | 0 |
| 2001 | 19 | 5 |
| 2002 | 15 | 18 |
| 2003 | 14 | 23 |
| 2004 | 19 | 15 |
| 2005 | 12 | 9 |
| 2006 | 12 | 5 |
| 2007 | 5 | 6 |
| 2008 | 2 | 10 |
| 2009 | 7 | 7 |
| 2010 | 8 | 9 |
| 2011 | 4 | 7 |
| 2012 | 9 | 7 |
| 2013 | 1 | 3 |
| 2014 | 11 | 6 |
| 2015 | 7 | 8 |
| 2016 | 8 | 2 |
| 2017 | 5 | 3 |
| 2018 | 7 | 10 |
| 2019 | 7 | 7 |
| 2020 | 4 | 4 |
| 2021 | 4 | 4 |
| 2022 | 4 | 5 |
| 2023 | 4 | 7 |
| 2024 | 4 | 6 |
| 2025 | 5 | 4 |
| 2026 | 3 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
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