H10P 76/4088
Processes for improving the resolution of the masks
Official title: {Processes for improving the resolution of the masks}
H10P76/4088 (Processes for improving the resolution of the masks) appears on 1,459 US grants and 1,507 published applications in this corpus.
Search patents in H10P- Granted patents
- 1,459
- Published applications
- 1,507
- Assignees
- 214
- Inventors
- 2,342
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 5 | 0 |
| 1996 | 2 | 0 |
| 1997 | 6 | 0 |
| 1998 | 12 | 0 |
| 1999 | 18 | 0 |
| 2000 | 15 | 0 |
| 2001 | 10 | 0 |
| 2002 | 16 | 11 |
| 2003 | 22 | 18 |
| 2004 | 20 | 30 |
| 2005 | 20 | 30 |
| 2006 | 26 | 55 |
| 2007 | 23 | 79 |
| 2008 | 35 | 105 |
| 2009 | 48 | 105 |
| 2010 | 77 | 103 |
| 2011 | 82 | 59 |
| 2012 | 111 | 95 |
| 2013 | 79 | 67 |
| 2014 | 92 | 67 |
| 2015 | 79 | 91 |
| 2016 | 81 | 77 |
| 2017 | 73 | 60 |
| 2018 | 69 | 64 |
| 2019 | 89 | 92 |
| 2020 | 84 | 82 |
| 2021 | 54 | 61 |
| 2022 | 56 | 59 |
| 2023 | 37 | 40 |
| 2024 | 48 | 31 |
| 2025 | 37 | 18 |
| 2026 | 18 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device, semiconductor structure and method for fabricating semiconductor device and semiconductor structure using tilted etch process6 Oct 2026US 12,757,661 B2Nanya Technology Corporation
- Method of manufacturing memory device using self-aligned double patterning (SADP)6 Oct 2026US 12,757,690 B2Nanya Technology Corporation
- Methods for forming mandrels and spacers, related structures, and systems1 Sep 2026US 12,727,444 B2ASM IP Holding B. V.
- Method for processing a substrate25 Aug 2026US 12,721,114 B2Tokyo Electron Limited
- Photo mask and lithography method using the same25 Aug 2026US 12,721,115 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Lithography method using photo mask8 Oct 2026US 2026/0314343 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Patterning material including carbon-containing layer andmethod for semiconductor device fabrication17 Sep 2026US 2026/0282864 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Plasma processing method9 Jul 2026US 2026/0198241 A1Hitachi High-Tech Corporation
- Method for manufacturing semiconductor device using an area selective deposition process11 Jun 2026US 2026/0165094 A1Samsung Electronics Co., Ltd.
- Methods of forming semiconductor structures23 Apr 2026US 2026/0114198 A1Semiconductor Manufacturing International (Shanghai) Corporation
Most cited
By later US patents
- Method for reducing, by a factor or 2.sup.-N, the minimum masking pitch of a photolithographic process1,059US 5,328,810 AMicron Technology, Inc. · 1994
- Frequency doubling using spacer mask774US 7,807,578 B2APPLIED Materials.Inc. · 2010
- Single spacer process for multiplying pitch by a factor greater than two and related intermediate IC structures742US 7,611,980 B2Micron Technology, Inc. · 2009
- Simplified pitch doubling process flow569US 7,732,343 B2Micron Technology, Inc. · 2010
- Mask material conversion555US 7,910,288 B2Micron Technology, Inc. · 2011