H10P 72/3202
Mechanical details
Official title: {Mechanical details, e.g. rollers or belts}
H10P72/3202 (Mechanical details) appears on 692 US grants and 846 published applications in this corpus.
Search patents in H10P- Granted patents
- 692
- Published applications
- 846
- Assignees
- 351
- Inventors
- 1,809
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 6 | 0 |
| 1986 | 7 | 0 |
| 1987 | 8 | 0 |
| 1988 | 3 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 6 | 0 |
| 1993 | 6 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 4 | 0 |
| 1998 | 7 | 0 |
| 1999 | 6 | 0 |
| 2000 | 10 | 0 |
| 2001 | 13 | 6 |
| 2002 | 15 | 9 |
| 2003 | 7 | 18 |
| 2004 | 12 | 3 |
| 2005 | 4 | 13 |
| 2006 | 5 | 8 |
| 2007 | 6 | 19 |
| 2008 | 6 | 18 |
| 2009 | 8 | 10 |
| 2010 | 7 | 26 |
| 2011 | 12 | 26 |
| 2012 | 13 | 27 |
| 2013 | 19 | 30 |
| 2014 | 19 | 31 |
| 2015 | 28 | 46 |
| 2016 | 37 | 35 |
| 2017 | 28 | 33 |
| 2018 | 29 | 25 |
| 2019 | 30 | 52 |
| 2020 | 38 | 71 |
| 2021 | 43 | 53 |
| 2022 | 43 | 59 |
| 2023 | 50 | 64 |
| 2024 | 55 | 70 |
| 2025 | 46 | 50 |
| 2026 | 43 | 44 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Transferring unit, article transferring system, and control method of transferring unit29 Sep 2026US 12,747,107 B2Semes Co., Ltd.
- Wafer alignment assembly of the solder reflow system29 Sep 2026US 12,751,247 B2Taiwan Semiconductor Manufacturing Company.Ltd
- System and method for automated wafer carrier handling8 Sep 2026US 12,733,440 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Buffer layer for dielectric protection in physical vapor deposition metal liner applications8 Sep 2026US 12,733,463 B2APPLIED Materials.Inc.
- Safety fence, transfer device including a safety fence and apparatus for processing a substrate including a safety fence4 Aug 2026US 12,698,599 B2Semes Co., Ltd.
- Semiconductor Thermal Processing Apparatus and Method for Transferring Workpieces by Carrier Device Thereof8 Oct 2026US 2026/0314307 A1Beijing Naura Microelectronics Equipment Co., Ltd.
- Substrate processing apparatus and substrate processing method8 Oct 2026US 2026/0314316 A1SCREEN Holdings Co., Ltd.
- Load port1 Oct 2026US 2026/0305238 A1Sinfonia Technology Co., Ltd.
- System and method for automated wafer carrier handling1 Oct 2026US 2026/0305243 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Multiple-chamber semiconductor serial constructing apparatus24 Sep 2026US 2026/0293583 A1Advanced Ion Beam Technology, Inc.
Most cited
By later US patents
- Method of clamping a substrate and clamp preparation unit using capillary clamping force288US 9,460,954 B2Mapper Lithography IP B.V. · 2016
- Materials transport system having inductive power transfer94US 6,397,990 B1PRI Automation, Inc. · 2002
- Apparatus for handling and transporting plate like substrates92US 6,109,677 ASez North America, Inc. · 2000
- Conveyor system88US 4,682,927 ANacom Industries, Inc. · 1987
- Linear induction semiconductor wafer transportation apparatus80US 4,624,617 A1986