H10P 72/1921
Characterised by substrate supports
Official title: {characterised by substrate supports}
H10P72/1921 (Characterised by substrate supports) appears on 318 US grants and 372 published applications in this corpus.
Search patents in H10P- Granted patents
- 318
- Published applications
- 372
- Assignees
- 120
- Inventors
- 648
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 4 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 7 | 0 |
| 1999 | 4 | 0 |
| 2000 | 4 | 0 |
| 2001 | 3 | 2 |
| 2002 | 6 | 4 |
| 2003 | 0 | 8 |
| 2004 | 5 | 11 |
| 2005 | 6 | 14 |
| 2006 | 6 | 23 |
| 2007 | 5 | 8 |
| 2008 | 13 | 7 |
| 2009 | 6 | 17 |
| 2010 | 6 | 6 |
| 2011 | 5 | 9 |
| 2012 | 5 | 4 |
| 2013 | 10 | 10 |
| 2014 | 7 | 11 |
| 2015 | 5 | 15 |
| 2016 | 13 | 14 |
| 2017 | 12 | 24 |
| 2018 | 16 | 27 |
| 2019 | 26 | 17 |
| 2020 | 24 | 36 |
| 2021 | 20 | 21 |
| 2022 | 19 | 15 |
| 2023 | 19 | 17 |
| 2024 | 17 | 21 |
| 2025 | 19 | 18 |
| 2026 | 7 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate storing container and lid-body-side substrate support part22 Sep 2026US 12,745,597 B2Miraial Co., Ltd.
- Substrate container equipped with stabilizing support and smooth tray connection28 Jul 2026US 12,696,719 B2Gudeng Precision Industrial Co., Ltd.
- Reticle pod having anti-collision gap structure14 Jul 2026US 12,685,077 B2Gudeng Precision Industrial Co., Ltd.
- Enclosure system shelf including alignment features23 Jun 2026US 12,666,907 B2APPLIED Materials.Inc.
- Wafer transport method and apparatus2 Jun 2026US 12,648,407 B2Taiwan Semiconductor Manufacturing Company.Ltd
- System and method of offset inspection1 Oct 2026US 2026/0305231 A1Gudeng Precision Industrial Co., Ltd.
- Front opening unified pod for containing square substrates and circular substrates10 Sep 2026US 2026/0271662 A1Stek Co., Ltd.
- Cassette hold down with contact arms2 Jul 2026US 2026/0190928 A1Entegris, Inc.
- Cassette for Vapor Processing Chamber2 Jul 2026US 2026/0190929 A1APPLIED Materials.Inc.
- Container for semiconductor wafers with soft landings and safe storage4 Jun 2026US 2026/0157142 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method and apparatus for batch processing of wafers in a furnace511US 6,835,039 B2ASM International N.V. · 2004
- Front opening ring pod128US 9,881,820 B2Lam Research Corporation · 2018
- Substrate holding case75US 5,353,934 ADai Nippon Printing Co.Ltd. · 1994
- Shipping container for silicone semiconductor wafers73US 4,043,451 AFluoroware, Inc. · 1977
- Cushioned wafer container68US 6,267,245 B1Fluoroware, Inc. · 2001