Cassette for Vapor Processing Chamber
AssigneeApplied Materials, Inc.
InventorsAndrew Nguyen, Ajit Balakrishna, Sue-Ann Yow, Eric Liu, Vijayabhaskara Venkatagiriyappa
Life of this patent
Estimating the term…
Abstract
Wafer cassette configured for a vapor processing chamber, a vapor processing chamber comprised the wafer cassette and deposition methods using the wafer cassette are described. The wafer cassette comprises a base plate with a support upright on a top surface thereof. The support upright has a plurality of spaced apart support plates. Each support plate has a flat inlet end and an outlet end with a circular segment cutout. The circular segment cutout extends in the range of 160° to 230°.
Claims20
A wafer cassette configured for a vapor processing chamber, the wafer cassette comprising:
- a base plate;
- and
- a support upright on a top surface of the base plate, the support upright having a plurality of spaced apart support plates, each support plate having a flat inlet end and an outlet end with a circular segment cutout, the circular segment cutout extending in the range of 160° to 230°.
A vapor deposition processing chamber comprising:
- a reaction chamber having a top wall, sidewalls with an inlet end and an outlet end, with an opening in a bottom wall;
- and
- a wafer cassette comprising a base plate, and a support upright on a top surface of the base plate, the support upright having a plurality of spaced apart support plates, each support plate having a flat inlet end and an outlet end with a circular segment cutout, the circular segment cutout extending in the range of 160° to 230°,
- wherein the base plate of the wafer cassette seals the opening in the bottom wall of the reaction chamber.
A method of improving gas flow uniformity is a cross-flow batch processing chamber, the method comprising:
- positioning a wafer cassette into the processing chamber, the wafer cassette comprising a base plate, and a support upright on a top surface of the base plate, the support upright having a plurality of spaced apart support plates, each support plate having a flat inlet end and an outlet end with a circular segment cutout, the circular segment cutout extending in the range of 160° to 230°;
- and
- flowing a process gas from an inlet of the processing chamber across through a gap between the spaced apart support plates to an outlet of the processing chamber.
Dependencies are inferred from the claim text.