Enclosure system shelf including alignment features

An enclosure system of a substrate processing system, the enclosure system comprising:

• a plurality of surfaces that at least partially enclose an interior volume of the enclosure system;
• and
• a shelf system comprising:
• a first distal portion comprising a first distal end and a second distal end opposite the first distal end, the second distal end being fastened to a first surface of the enclosure system, the first distal portion comprising:
• a first planar surface that extends from the first distal end to a first sidewall;
• a first carrier alignment feature comprising the first sidewall that extends upwards from the first planar surface;
• a second planar surface that extends from the second distal end to a second sidewall;
• and
• a first process kit ring alignment feature comprising the second sidewall that extends upwards from the second planar surface;
• and
• a second distal portion fastened to a second surface of the enclosure system, the second distal portion comprising a second carrier alignment feature and a second process kit ring alignment feature, wherein the first carrier alignment feature and the second carrier alignment feature are configured to be disposed proximate outer surfaces of a carrier to align the carrier in the enclosure system, and wherein the first process kit ring alignment feature and the second process kit ring alignment feature are configured to be proximate inner surfaces of a process kit ring to align the process kit ring on the carrier in the enclosure system.

A method comprising:

• transporting a carrier supporting a process kit ring to a position above a shelf system disposed within an enclosure system of a substrate processing system;
• and
• lowering the carrier supporting the process kit ring onto the shelf system to cause the carrier to be aligned via a first carrier alignment feature of a first distal portion and a second carrier alignment feature of a second distal portion of the shelf system and to cause the process kit ring to be aligned via a first process kit ring alignment feature of the first distal portion and a second process kit ring alignment feature of the second distal portion of the shelf system, the first distal portion comprising a first distal end and a second distal end opposite the first distal end, the first distal portion further comprising a first planar surface that extends from the first distal end to a first sidewall, the first carrier alignment feature comprising the first sidewall that extends upwards from the first planar surface, the first distal portion further comprising a second planar surface that extends from the second distal end to a second sidewall, the first process kit ring alignment feature comprising the second sidewall that extends upwards from the second planar surface, wherein the second distal end of the first distal portion is fastened to a first surface of the enclosure system and the second distal portion is fastened to a second surface of the enclosure system, wherein the first carrier alignment feature and the second carrier alignment feature are configured to be disposed proximate outer surfaces of the carrier, and wherein the first process kit ring alignment feature and the second process kit ring alignment feature are configured to be proximate inner surfaces of the process kit ring.