Front opening ring pod
AssigneeLam Research Corporation
InventorsScott Wong, Damon Tyrone Genetti, Derek John Witkowicki, Alex Paterson, Richard H. Gould, Austin Ngo, Marc Estoque
Life of this patent
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AssigneeLam Research Corporation
InventorsScott Wong, Damon Tyrone Genetti, Derek John Witkowicki, Alex Paterson, Richard H. Gould, Austin Ngo, Marc Estoque
Estimating the term…
A pod for exchanging consumable parts with a process module includes a base plate having a front side, a back side, and first and second lateral sides. A first support column is disposed on the first lateral side proximal to the front side. A second support column is disposed on the second lateral side proximal to the front side. A third support column is disposed on the first lateral side proximal to back side and a fourth support column is disposed on the second lateral side proximal to the back side. Each of the support columns includes a plurality of support fingers distributed lengthwise and directed inward. A first hard stop column is disposed parallel to the third support column and a second hard stop column is disposed parallel to the fourth support column. A shell structure connected to the base plate is configured to enclose the first, second third and fourth support columns, top plate and first and second hard stop columns and includes a front opening disposed on the front side of the base plate. A door is mated to the front opening and includes retention assembly for securing consumable parts in the pod, when received in the pod.
A pod for exchanging consumable parts of a process module, comprising:
A pod for holding consumable parts to be supplied or returned from a process module, the process module is configured to process semiconductor substrates and processing of the semiconductor substrates causes a wear upon the consumable parts, the pod comprising,
Dependencies are inferred from the claim text.