H10P 72/0464
Characterised by the construction of the transfer chamber
Official title: {characterised by the construction of the transfer chamber}
H10P72/0464 (Characterised by the construction of the transfer chamber) appears on 993 US grants and 1,313 published applications in this corpus.
Search patents in H10P- Granted patents
- 993
- Published applications
- 1,313
- Assignees
- 229
- Inventors
- 2,230
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 2 | 0 |
| 1991 | 4 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 4 | 0 |
| 1997 | 9 | 0 |
| 1998 | 5 | 0 |
| 1999 | 14 | 0 |
| 2000 | 17 | 0 |
| 2001 | 25 | 14 |
| 2002 | 17 | 31 |
| 2003 | 23 | 18 |
| 2004 | 15 | 21 |
| 2005 | 15 | 25 |
| 2006 | 16 | 36 |
| 2007 | 8 | 26 |
| 2008 | 16 | 76 |
| 2009 | 8 | 33 |
| 2010 | 15 | 27 |
| 2011 | 23 | 27 |
| 2012 | 21 | 30 |
| 2013 | 30 | 15 |
| 2014 | 18 | 27 |
| 2015 | 32 | 36 |
| 2016 | 27 | 40 |
| 2017 | 23 | 64 |
| 2018 | 59 | 57 |
| 2019 | 51 | 80 |
| 2020 | 53 | 98 |
| 2021 | 56 | 93 |
| 2022 | 85 | 107 |
| 2023 | 73 | 129 |
| 2024 | 82 | 80 |
| 2025 | 81 | 62 |
| 2026 | 51 | 61 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium15 Sep 2026US 12,740,361 B2Kokusai Electric Corporation
- Semiconductor system with an integrated wafer humidity control device8 Sep 2026US 12,733,431 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate processing system and maintenance method8 Sep 2026US 12,733,432 B2Tokyo Electron Limited
- Substrate processing system and condition monitoring method25 Aug 2026US 12,721,098 B2Tokyo Electron Limited
- Substrate processing apparatus and transfer method25 Aug 2026US 12,721,106 B2Tokyo Electron Limited
- Substrate processing system, storage module, and substrate processing method1 Oct 2026US 2026/0305237 A1Tokyo Electron Limited
- Passage chamber10 Sep 2026US 2026/0271663 A1Samsung Display Co., Ltd.
- Robot arm with vacuum-compatible seals and internal cooling flow paths10 Sep 2026US 2026/0271664 A1Lam Research Corporation
- Substrate Processing Apparatus, Method of Detecting Tilt of Substrate Retainer, Substrate Processing Method, Method of Manufacturing Semiconductor Device and Non-transitory Computer-readable Recording Medium20 Aug 2026US 2026/0247909 A1Kokusai Electric Corporation
- Method of Controlling Substrate Transfer System20 Aug 2026US 2026/0247914 A1Tokyo Electron Limited
Most cited
By later US patents
- Ultra high throughput wafer vacuum processing system973US 5,855,681 AAPPLIED Materials.Inc. · 1999
- Compartnetalized substrate processing chamber732US 5,730,801 AAPPLIED Materials.Inc. · 1998
- Systems and methods for robotic transfer of workpieces between a storage area and a processing chamber658US 6,315,512 B1Mattson Technology, Inc. · 2001
- Modular architecture for semiconductor wafer fabrication equipment638US 6,312,525 B1APPLIED Materials.Inc. · 2001
- Modular processing apparatus for processing semiconductor wafers635US 4,722,298 AMachine Technology, Inc. · 1988