Substrate processing system and condition monitoring method

A method of monitoring, in a substrate processing system including a substrate processing apparatus configured to execute a predetermined processing on a substrate and a transfer device, an internal temperature of the substrate processing apparatus,

• wherein, in the substrate processing system,
• the substrate processing apparatus includes a loading/unloading port for the substrate,
• the transfer device is connected to the substrate processing apparatus via an opening/closing mechanism configured to open/close the loading/unloading port, and includes a substrate transfer mechanism configured to load and unload the substrate into and from the substrate processing apparatus via the loading/unloading port, and
• the substrate processing system further includes a thermal image generator provided on the substrate transfer mechanism and configured to generate a thermal image,
• the method comprises:
• opening, by the opening/closing mechanism, the loading/unloading port at a time before and/or after the substrate processing apparatus executes the predetermined processing;
• and
• generating, by the thermal image generator, an in-apparatus thermal image as the thermal image indicating a temperature distribution inside the substrate processing apparatus, and
• wherein the method further comprises:
• generating, by the thermal image generator, the in-apparatus thermal image in a state in which the thermal image generator is located inside the transfer device, and
• wherein the method further comprises:
• generating, by the thermal image generator, the in-apparatus thermal image in a state in which a jig is located inside the substrate processing apparatus, the jig being configured to be transferred by the substrate transfer mechanism and including a reflecting member configured to reflect an infrared ray toward the thermal image generator, and
• wherein the jig has a shape corresponding to the substrate.