Semiconductor system with an integrated wafer humidity control device

A semiconductor fabrication system, comprising:

• an equipment front end module with a load port to transfer semiconductor wafers to the equipment front end module from a wafer carrier;
• and
• a wafer humidity control device embedded in the equipment front end module and configured to generate an air curtain to protect the semiconductor wafers, wherein the wafer humidity control device further includes a gas entry layer with a gas inlet to receive a gas;
• a uniform layer integrated with the gas entry layer and designed to redistribute the gas;
• a diversion structure having multiple pieces assembled together and holding the uniform layer;
• and
• a saturated pressure layer designed to maintain a pressure of the gas and configured between the gas entry layer and the diversion structure, wherein the saturated pressure layer includes a first group of holes configured in a first region closer to the gas inlet, and a second group of holes configured in a second region distanced far away from the gas inlet,
• the first group of holes has a first hole size and a first pitch among the first group of holes, and
• the second group of holes has a second hole size greater than the first hole size and a second pitch less than the first pitch,
• wherein the saturated pressure layer further includes a third group of holes configured in four corners of the saturated pressure layer;
• and
• the third group of holes has a third hole size greater than the second hole size and a third pitch less than the second pitch.

A semiconductor fabrication system, comprising:

• an equipment front end module with a load port to transfer semiconductor wafers to the equipment front end module from a wafer carrier;
• a processing tool coupled with the equipment front end module and designed for applying a fabrication process to the semiconductor wafers;
• and
• a wafer humidity control device embedded in the equipment front end module and configured to generate an air curtain to protect the semiconductor wafers, wherein the wafer humidity control device further includes
• a gas entry layer with a gas inlet to receive a gas;
• a uniform layer integrated with the gas entry layer and designed to redistribute the gas;
• a diversion structure having two L-shaped features assembled together and housing the uniform layer;
• and
• a saturated pressure layer designed to maintain a pressure of the gas and secured between the gas entry layer and the diversion structure, wherein
• the saturated pressure layer includes a first group of holes configured in a first region closer to the gas inlet, a second group of holes configured in a second region distanced far away from the gas inlet, and a third group of holes configured in four corners of the saturated pressure layer,
• the first group of holes has a first hole size and a first pitch among the first group of holes,
• the second group of holes has a second hole size greater than the first hole size and a second pitch less than the first pitch, and
• the third group of holes has a third hole size greater than the second hole size and a third pitch less than the second pitch.