Substrate processing apparatus and transfer method
AssigneeTokyo Electron Limited
InventorTakayasu Kiyokawa
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AssigneeTokyo Electron Limited
InventorTakayasu Kiyokawa
Estimating the term…
There is provided a substrate processing apparatus comprising: a first placement chamber; a second placement chamber; a transfer robot; and a controller. The controller is configured to: a) control the apparatus such that a position of an object on a fork of the transfer robot is detected as a first position when unloading the object from the first placement chamber; b) control the apparatus such that the object is unloaded from the first placement chamber to a standby position of the first placement chamber and then transferred to a standby position of the second placement chamber; c) control the apparatus such that a position of the object on the fork is detected as a second position when loading the object to the second placement chamber; and d) control the apparatus such that a transfer speed of b) is controlled based on the first position and the second position.
A substrate processing apparatus comprising:
A transfer method in a substrate processing apparatus, wherein the substrate processing apparatus includes:
Dependencies are inferred from the claim text.