H10P 72/0461
Characterised by the presence of two or more transfer chambers
Official title: {characterised by the presence of two or more transfer chambers}
H10P72/0461 (Characterised by the presence of two or more transfer chambers) appears on 673 US grants and 904 published applications in this corpus.
Search patents in H10P- Granted patents
- 673
- Published applications
- 904
- Assignees
- 128
- Inventors
- 1,586
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 4 | 0 |
| 1998 | 6 | 0 |
| 1999 | 12 | 0 |
| 2000 | 10 | 0 |
| 2001 | 13 | 7 |
| 2002 | 13 | 15 |
| 2003 | 11 | 25 |
| 2004 | 10 | 28 |
| 2005 | 19 | 31 |
| 2006 | 12 | 44 |
| 2007 | 21 | 26 |
| 2008 | 13 | 44 |
| 2009 | 11 | 29 |
| 2010 | 24 | 20 |
| 2011 | 19 | 17 |
| 2012 | 21 | 24 |
| 2013 | 17 | 15 |
| 2014 | 16 | 30 |
| 2015 | 25 | 19 |
| 2016 | 24 | 17 |
| 2017 | 12 | 24 |
| 2018 | 17 | 20 |
| 2019 | 32 | 48 |
| 2020 | 32 | 71 |
| 2021 | 56 | 69 |
| 2022 | 38 | 75 |
| 2023 | 40 | 75 |
| 2024 | 60 | 60 |
| 2025 | 48 | 42 |
| 2026 | 27 | 29 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Storage and transfer module and substrate treatment apparatus including storage and transfer module29 Sep 2026US 12,748,355 B2Semes Co., Ltd.
- Treatments to enhance material structures25 Aug 2026US 12,721,061 B2APPLIED Materials.Inc.
- Surface profiling and texturing of chamber components18 Aug 2026US 12,713,846 B2APPLIED Materials.Inc.
- Carbon-containing cap layer for doped semiconductor epitaxial layer4 Aug 2026US 12,701,762 B2APPLIED Materials.Inc.
- Radical plasma treatment for semiconductor metal gate stack4 Aug 2026US 12,701,938 B2APPLIED Materials.Inc.
- Multiple-chamber semiconductor serial constructing apparatus24 Sep 2026US 2026/0293583 A1Advanced Ion Beam Technology, Inc.
- Substrate transfer method, substrate processing apparatus, and program13 Aug 2026US 2026/0235967 A1Tokyo Electron Limited
- Substrate processing apparatus and substrate processing method6 Aug 2026US 2026/0231727 A1
- Substrate processing apparatus16 Jul 2026US 2026/0200034 A1Ebara Corporation
- Spectral sensing of process chamber conditions16 Jul 2026US 2026/0202340 A1Lam Research Corporation
Most cited
By later US patents
- Multi-chamber integrated process system988US 4,951,601 AAPPLIED Materials.Inc. · 1990
- Staged-vacuum wafer processing system and method701US 5,186,718 AAPPLIED Materials.Inc. · 1993
- Wafer processing cluster tool batch preheating and degassing apparatus663US 5,259,881 AMaterials Research Corporation · 1993
- Method and apparatus for scheduling wafer processing within a multiple chamber semiconductor wafer processing tool having a multiple blade robot619US 6,074,443 AAPPLIED Materials.Inc. · 2000
- Multiple chamber integrated process system612US 5,882,165 AAPPLIED Materials.Inc. · 1999