Surface profiling and texturing of chamber components

A method, comprising:

• measuring a parameter of a reference substrate using one or more sensors, wherein the measured parameter is a temperature of the reference substrate that is determined based on a measurement of at least one of a substrate film thickness, a dielectric constant, or a substrate film stress;
• determining deposition film thickness non-uniformities across the reference substrate or thermal non-uniformities across the reference substrate based on the measured parameter;
• texturizing a surface of a chamber component in a non-uniform manner based on the deposition film thickness non-uniformities or the thermal non-uniformities so that the texturized surface improves film uniformity on a substrate during processing, wherein texturizing the chamber component comprises at least one of:
• making some portions of the chamber component smoother and making other portions of the chamber component rougher to provide the chamber component with a surface finish having regions of different emissivity, or
• changing a surface area in different regions of the surface;
• and
• applying a transfer function to the measured parameter of the reference substrate to generate a target pattern and the texturizing is based on the target pattern, wherein the transfer function is based on multiple weighted inputs of the measured parameter.

A non-transitory computer readable medium for storing computer instructions that, when executed by at least one processor causes the at least one processor to perform a method comprising:

• measuring a parameter of a reference substrate using one or more sensors, wherein the measured parameter is a temperature of the reference substrate that is determined based on a measurement of at least one of a substrate film thickness, a dielectric constant, or a substrate film stress;
• determining deposition film thickness non-uniformities across the reference substrate or thermal non-uniformities across the reference substrate based on the measured parameter;
• and
• texturizing a surface of a chamber component in a non-uniform manner based on the deposition film thickness non-uniformities or the thermal non-uniformities so that the texturized surface improves film uniformity on a substrate during processing, wherein texturizing the chamber component comprises at least one of:
• making some portions of the chamber component smoother and making other portions of the chamber component rougher to provide the chamber component with a surface finish having regions of different emissivity, or
• changing a surface area in different regions of the surface.