H10P 72/0438
Apparatus for making assemblies not otherwise provided for
Official title: {Apparatus for making assemblies not otherwise provided for, e.g. package constructions}
H10P72/0438 (Apparatus for making assemblies not otherwise provided for) appears on 207 US grants and 206 published applications in this corpus.
Search patents in H10P- Granted patents
- 207
- Published applications
- 206
- Assignees
- 151
- Inventors
- 631
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 4 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 6 | 0 |
| 1990 | 6 | 0 |
| 1991 | 4 | 0 |
| 1992 | 8 | 0 |
| 1993 | 5 | 0 |
| 1994 | 9 | 0 |
| 1995 | 4 | 0 |
| 1996 | 3 | 0 |
| 1997 | 4 | 0 |
| 1998 | 5 | 0 |
| 1999 | 5 | 0 |
| 2000 | 1 | 0 |
| 2001 | 5 | 1 |
| 2002 | 2 | 2 |
| 2003 | 3 | 11 |
| 2004 | 3 | 3 |
| 2005 | 4 | 2 |
| 2006 | 6 | 5 |
| 2007 | 2 | 2 |
| 2008 | 3 | 3 |
| 2009 | 0 | 2 |
| 2010 | 1 | 1 |
| 2011 | 0 | 1 |
| 2012 | 0 | 1 |
| 2013 | 0 | 2 |
| 2014 | 3 | 3 |
| 2015 | 0 | 5 |
| 2016 | 3 | 2 |
| 2017 | 2 | 7 |
| 2018 | 10 | 12 |
| 2019 | 13 | 18 |
| 2020 | 14 | 14 |
| 2021 | 8 | 8 |
| 2022 | 6 | 11 |
| 2023 | 8 | 25 |
| 2024 | 18 | 22 |
| 2025 | 11 | 13 |
| 2026 | 9 | 30 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Pick-and-place tool with warpage-correction mechanism22 Sep 2026US 12,745,603 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Vacuum packaging manufacturing method and semiconductor devices manufactured thereby25 Aug 2026US 12,721,057 B2Seoul National University R&Db Foundation
- System and method for optimizing through silicon via overlay2 Jun 2026US 12,645,152 B2KLA Corporation
- Method and apparatus for bonding semiconductor substrate26 May 2026US 12,642,042 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Notched wafer and bonding support structure to improve wafer stacking5 May 2026US 12,622,303 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Press die device, upper die fixture having the same, and press apparatus17 Sep 2026US 2026/0282807 A1All Ring Tech Co., Ltd.
- Apparatus for bonding semiconductor substrate17 Sep 2026US 2026/0282808 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate holding device, substrate manufacturing apparatus, and substrate manufacturing method27 Aug 2026US 2026/0255926 A1Ebara Corporation
- Designs of nano-precise short stroke stages for actuation20 Aug 2026US 2026/0247903 A1Board of Regents, The University of Texas System
- Heat dissipation material attaching apparatus, heat dissipation material feeding method, and heat dissipation material attaching method20 Aug 2026US 2026/0247904 A1Horng Terng Automation Co., Ltd.
Most cited
By later US patents
- Apparatus for zone melting recrystallization of thin semiconductor film221US 5,304,357 ARicoh Company, Ltd. · 1994
- Integrated circuit adapter having gullwing-shaped leads181US 5,151,039 AAdvanced Interconnections Corporation · 1992
- Electronic packages and smart structures formed by thermal spray deposition157US 5,278,442 A1994
- Method for producing thin film multilayer substrate, and method and apparatus for detecting circuit conductor pattern of the substrate139US 5,278,012 AHitachi, Ltd. · 1994
- Apparatus and method for positioning an integrated circuit chip within a multichip module113US 5,144,747 AIntegrated System Assemblies Corporation · 1992