Apparatus and method for positioning an integrated circuit chip within a multichip module

A method for attaching a first and second integrated circuit chips to an upper surface of a substrate having a reference feature thereon, said attaching method utilizing a high accuracy XY table, said table having a first rotational adjustment stage and a second rotational adjustment stage, said first rotational adjustment stage comprising a chip alignment stage and said second rotational adjustment stage comprising a substrate alignment stage, said attaching method further utilizing a chip pickup and memory storage means having at least a prestored desired location information for said second chip relative to a reference feature of said first chip, said method comprising the steps of:

• (a) placing the substrate on said substrate alignment stage, said substrate having an adhesively coated upper surface;
• (b) aligning said substrate relative to XY table motion;
• (c) locating and saving in said memory means the position of the substrate reference feature;
• (d) placing the first chip on said chip alignment stage;
• (e) aligning said first chip relative to XY table motion, said first chip aligning being accomplished with reference to at least one reference feature of said first chip;
• (f) energizing said chip pickup to lift said first chip from said chip alignment stage;
• (g) positioning said substrate under said first chip by moving said XY table;
• (h) recalling from said memory means the stored offset for said first chip relative to said substrate reference feature;
• (i) lowering said first chip to the desired location on the upper surface of said substrate based on said recalled, first chip offset location, and allowing a portion of the weight of said chip pickup to be applied to said first chip;
• (j) releasing said first chip from said chip pickup;
• (k) placing the second chip on said chip alignment stage;
• (l) aligning said second chip relative to XY table motion, said second chip aligning being accomplished with reference to at least one characteristic feature of said second chip;
• (m) energizing said chip pickup to lift said second chip from said chip alignment stage;
• (n) positioning said substrate under said second chip by moving said XY table;
• (o) recalling from said memory means the prestored desired location information for said second chip relative to a reference feature of said first chip;
• (p) lowering said second chip to the desired location on the upper surface of said substrate based on said recalled, second chip offset location, and allowing a portion of the weight of said chip pickup to be applied to said second chip;
• and
• (q) releasing said second chip from said pickup.

Apparatus for accurately positioning a die relative to a substrate having a fiducial mark thereon, said apparatus comprising:

• a high accuracy XY table, said table having a first rotational adjustment stage and a second rotational adjustment stage, said first rotational adjustment stage comprising a die alignment stage for holding and aligning a die relative to XY table motion based on a physical feature of the die, said second rotational adjustment stage comprising a substrate alignment stage, said substrate alignment stage including means for holding said substrate having said fiducial mark thereon;
• locating means operatively associated with said high accuracy XY table for locating the fiducial mark on said substrate;
• a die pickup operatively associated with said high accuracy XY table for removing said die from said die alignment stage and for placing said die on said substrate;
• and
• control processing means coupled to said first and second rotational adjustment stages of said XY table, said locating means and said die pickup, for controlling the respective alignment of said substrate and said die, and transfer of said die to the desired location on said substrate relative to said located fiducial mark using said die pickup.

Apparatus for accurately positioning a die having a first physical feature relative to a substrate having a second physical feature, said apparatus comprising:

• a high accuracy XY table, said table having a first rotational adjustment stage and a second rotational adjustment stage, said first rotational adjustment stage comprising a die alignment stage for holding and aligning the die relative to XY table motion based on said first physical feature of the die, said second rotational adjustment stage comprising a substrate alignment stage, said substrate alignment stage including means for holding said substrate;
• locating means operatively associated with said high accuracy XY table for locating said second physical feature on said substrate;
• a die pickup operatively associated with said high accuracy XY table for removing said die from said die alignment stage and for placing said die on said substrate;
• and
• control processing means coupled to said first and second rotational adjustment stages of said XY table, said locating means and said die pickup, for controlling the respective alignment of said substrate and said die, and transfer of said die to the desired location on said substrate relative to said located substrate second physical feature.