Method and apparatus for bonding semiconductor substrate

A method of bonding semiconductor chips, comprising:

• placing a semiconductor wafer on a chuck table, wherein the semiconductor wafer comprises a first bonding region for a first semiconductor chip;
• measuring a first warpage amount of the first semiconductor chip to determine a main bonding position of the first semiconductor chip;
• performing a deforming process on the chuck table and the semiconductor wafer, wherein after the deforming process, a wafer bonding position in the first bonding region of the semiconductor wafer is protruding towards the main bonding position of the first semiconductor chip;
• and
• bonding the first semiconductor chip to the semiconductor wafer by joining the main bonding position of the first semiconductor chip to the wafer bonding position in the first bonding region of the semiconductor wafer.

A chip-on-wafer bonding method, comprising:

• placing a semiconductor wafer on a chuck table;
• providing a first semiconductor chip having a smile warpage or a cry warpage;
• performing a deforming process on the semiconductor wafer, wherein when the first semiconductor chip has the smile warpage, a first bonding region of the semiconductor wafer is deformed to have a cry warpage, and when the first semiconductor chip has a cry warpage, the first bonding region of the semiconductor wafer is deformed to have a smile warpage, and the deforming process is performed so that the chuck table is deformed along with the semiconductor wafer;
• and
• bonding the first semiconductor chip to the first bonding region of the semiconductor wafer.