H10P 14/6508
By exposure to a liquid
Official title: {by exposure to a liquid}
H10P14/6508 (By exposure to a liquid) appears on 181 US grants and 159 published applications in this corpus.
Search patents in H10P- Granted patents
- 181
- Published applications
- 159
- Assignees
- 101
- Inventors
- 448
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 3 | 0 |
| 2000 | 5 | 0 |
| 2001 | 13 | 1 |
| 2002 | 9 | 7 |
| 2003 | 10 | 8 |
| 2004 | 4 | 8 |
| 2005 | 6 | 10 |
| 2006 | 6 | 10 |
| 2007 | 4 | 1 |
| 2008 | 1 | 6 |
| 2009 | 3 | 2 |
| 2010 | 2 | 3 |
| 2011 | 1 | 2 |
| 2012 | 4 | 5 |
| 2013 | 4 | 3 |
| 2014 | 3 | 5 |
| 2015 | 5 | 3 |
| 2016 | 6 | 12 |
| 2017 | 9 | 9 |
| 2018 | 11 | 18 |
| 2019 | 13 | 6 |
| 2020 | 12 | 9 |
| 2021 | 2 | 6 |
| 2022 | 7 | 5 |
| 2023 | 6 | 6 |
| 2024 | 6 | 9 |
| 2025 | 3 | 3 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing semiconductor device4 Aug 2026US 12,701,937 B2Adeka Corporation
- Sequencing chip and manufacturing method therefor27 Jan 2026US 12,538,721 B2Bgi Shenzhen
- Liquid processing apparatus and liquid processing method1 Jul 2025US 12,347,698 B2Tokyo Electron Limited
- Surface modification layer for conductive feature formation1 Jul 2025US 12,347,724 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Apparatus and method for drying substrate20 May 2025US 12,308,255 B2Samsung Electronics Co., Ltd.
- Composition for treating semiconductor device and method for manufacturing modified substrate26 Feb 2026US 2026/0055291 A1FUJIFILM Corporation
- Method for forming an insulating layer pattern and semiconductor device19 Feb 2026US 2026/0052917 A1Dongjin Semichem Co., Ltd.
- Substrate processing method and substrate production method6 Nov 2025US 2025/0343040 A1Central Glass Company, Limited
- Surface modification layer for conductive feature formation25 Sep 2025US 2025/0300008 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Apparatus and method for drying substrate14 Aug 2025US 2025/0259862 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- System and method for forming a gate dielectric598US 6,858,547 B2APPLIED Materials.Inc. · 2005
- Method of passivating etched mirror facets of semiconductor laser diodes152US 5,177,031 AInternational Business Machines Corporation · 1993
- Ozone vapor clean method106US 7,157,351 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2007
- Method of forming oxide film92US 6,297,172 B1Sony Corporation · 2001
- Silicon nitride deposition method81US 5,939,333 AMicron Technology, Inc. · 1999