H10N 30/073
By fusion of metals or by adhesives
Official title: by fusion of metals or by adhesives
H10N30/073 (By fusion of metals or by adhesives) appears on 344 US grants and 459 published applications in this corpus.
Search patents in H10N- Granted patents
- 344
- Published applications
- 459
- Assignees
- 191
- Inventors
- 859
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 4 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 6 | 0 |
| 2001 | 3 | 2 |
| 2002 | 1 | 7 |
| 2003 | 5 | 9 |
| 2004 | 5 | 18 |
| 2005 | 10 | 8 |
| 2006 | 13 | 10 |
| 2007 | 7 | 6 |
| 2008 | 4 | 9 |
| 2009 | 8 | 14 |
| 2010 | 8 | 12 |
| 2011 | 8 | 11 |
| 2012 | 5 | 15 |
| 2013 | 11 | 9 |
| 2014 | 13 | 18 |
| 2015 | 13 | 23 |
| 2016 | 13 | 8 |
| 2017 | 18 | 21 |
| 2018 | 8 | 24 |
| 2019 | 19 | 23 |
| 2020 | 21 | 41 |
| 2021 | 16 | 41 |
| 2022 | 21 | 29 |
| 2023 | 28 | 30 |
| 2024 | 28 | 25 |
| 2025 | 20 | 24 |
| 2026 | 10 | 22 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Heterostructure and method of fabrication22 Sep 2026US 12,744,508 B2Soitec
- Integration techniques for micromachined pMUT arrays and electronics using solid liquid interdiffusion (SLID)11 Aug 2026US 12,704,626 B2Exo Imaging, Inc.
- Energy harvesting module and method of making an energy harvesting module11 Aug 2026US 12,706,553 B2TDK Corporation
- Piezoelectric vibrating substrate and piezoelectric vibrating element11 Aug 2026US 12,706,589 B2NGK Insulators, Ltd.
- Semiconductor substrate with oxide single crystal heterostructures, manufacturing method thereof and electronic device using the same5 May 2026US 12,622,173 B2Korea Institute of Science and Technology
- Method for producing a donor substrate for transferring a piezoelectric layer onto a carrier substrate8 Oct 2026US 2026/0312560 A1
- Method for manufacturing a structure comprising a barrier layer to prevent diffusion of atomic species27 Aug 2026US 2026/0255879 A1
- Substrate-mounted integrated structure comprising a ferroelectric layer with selective polarisation, and method for manufacturing same13 Aug 2026US 2026/0238189 A1
- Composite substrate and preparation method therefor6 Aug 2026US 2026/0231682 A1Tiantong Ruihong Technology Co., Ltd.
- Method for manufacturing two substrates called donor pseudo-substrates each comprising at least two tiles on a carrier substrate6 Aug 2026US 2026/0231741 A1
Most cited
By later US patents
- Thin layer composite unimorph ferroelectric driver and sensor142US 5,632,841 AThe United States of America as represented by the Administrator of the National Aeronautics and Space Administration · 1997
- Piezoelectric/electrostrictive actuator having ceramic substrate having recess defining thin-walled portion76US 5,210,455 ANGK Insulators, Ltd. · 1993
- Method of manufacturing flextensional transducer using pre-curved piezoelectric ceramic layer63US 5,849,125 A1998
- Layered unit provided with piezoelectric ceramics, method for producing the same, and ink jet printing head employing the same62US 6,626,526 B2KYOCERA Corporation · 2003
- Enhancements for adhesive attachment of piezoelectric motor elements to a disk drive suspension60US 6,856,075 B1Hutchinson Technology Incorporated · 2005