H10N 30/07
Forming of piezoelectric or electrostrictive parts or bodies on an electrical element
Official title: Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
H10N30/07 (Forming of piezoelectric or electrostrictive parts or bodies on an electrical element) appears on 2,213 US grants and 2,682 published applications in this corpus.
Search patents in H10N- Granted patents
- 2,213
- Published applications
- 2,682
- Assignees
- 661
- Inventors
- 3,489
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 4 | 0 |
| 1980 | 4 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 4 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 4 | 0 |
| 1992 | 7 | 0 |
| 1993 | 7 | 0 |
| 1994 | 12 | 0 |
| 1995 | 11 | 0 |
| 1996 | 9 | 0 |
| 1997 | 19 | 0 |
| 1998 | 15 | 0 |
| 1999 | 15 | 0 |
| 2000 | 30 | 0 |
| 2001 | 29 | 12 |
| 2002 | 39 | 47 |
| 2003 | 31 | 59 |
| 2004 | 31 | 76 |
| 2005 | 44 | 85 |
| 2006 | 62 | 83 |
| 2007 | 56 | 62 |
| 2008 | 42 | 69 |
| 2009 | 65 | 90 |
| 2010 | 63 | 94 |
| 2011 | 72 | 112 |
| 2012 | 55 | 113 |
| 2013 | 89 | 113 |
| 2014 | 115 | 110 |
| 2015 | 111 | 130 |
| 2016 | 106 | 92 |
| 2017 | 93 | 128 |
| 2018 | 81 | 137 |
| 2019 | 127 | 153 |
| 2020 | 116 | 159 |
| 2021 | 95 | 177 |
| 2022 | 119 | 134 |
| 2023 | 146 | 153 |
| 2024 | 99 | 118 |
| 2025 | 101 | 107 |
| 2026 | 65 | 69 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Hybrid structure for a surface acoustic wave device6 Oct 2026US 12,757,634 B2Soitec
- Piezoelectric element, method for manufacturing piezoelectric element, and liquid ejection head6 Oct 2026US 12,757,636 B2Canon Kabushiki Kaisha
- Heterostructure and method of fabrication22 Sep 2026US 12,744,508 B2Soitec
- Microphone device based on two-dimensional piezoelectric material layer having protective layer formed thereon, and method for fabricating the same22 Sep 2026US 12,745,045 B2Research & Business Foundation Sungkyunkwan University
- Manufacturing method of piezoelectric element, piezoelectric element, and liquid droplet dispensing head22 Sep 2026US 12,745,565 B2Seiko Epson Corporation
- Method for producing a donor substrate for transferring a piezoelectric layer onto a carrier substrate8 Oct 2026US 2026/0312560 A1
- Method for preparing a thin layer of ferroelectric material1 Oct 2026US 2026/0305172 A1
- Method for manufacturing array sensor element and array sensor element1 Oct 2026US 2026/0305173 A1Seiko Epson Corporation
- Method for preparing a single-domain thin layer made of lithium-containing ferroelectric material1 Oct 2026US 2026/0305174 A1
- Planar linear array for ultrasound24 Sep 2026US 2026/0283595 A1Fujifilm Sonosite, Inc.
Most cited
By later US patents
- Method and apparatus for preparing integrated circuit thin films by chemical vapor deposition442US 6,110,531 ASymetrix Corporation · 2000
- Ferroelectric dielectric memory cell can switch at least giga cycles and has low fatigue - has high dielectric constant and low leakage current416US 5,519,234 ASymetrix Corporation · 1996
- Method for producing an electronic component using direct bonding273US 5,771,555 AMatsushita Electric Industrial Co., Ltd. · 1998
- Method for producing piezoelectric composite substrate267US 8,932,686 B2Murata Manufacturing Co., Ltd. · 2015
- Method for manufacturing a vibrating MEMS circuit263US 9,369,105 B1RF Micro Devices, Inc. · 2016