Planar linear array for ultrasound
AssigneeFujifilm Sonosite, Inc.
InventorsGuofeng PANG, Oleg IVANYTSKYY, Robert KOLAJA
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Abstract
Examples herein include piezoelectric layers of an ultrasound transducer, ultrasound transducers, methods of manufacturing the transducers, and methods of manufacturing the piezoelectric layers of an ultrasound transducer. In one example, a piezoelectric layer of an ultrasound transducer include a non-metallic frame and a piezoelectric material. The nonmetallic frame surrounds the piezoelectric material on at least two sides and is coupled to a lens support structure with a structure such that an acoustic lens and the piezoelectric material are oriented substantially parallel to each other. The piezoelectric material is sized to span an area greater than or equal to an active surface of the acoustic lens.
Claims21
An ultrasound transducer, comprising:
- a piezoelectric layer comprising:
- a non-metallic frame;
- and
- a piezoelectric material disposed within the non-metallic frame, wherein the non-metallic frame includes a plurality of cutouts extending along one or more sides of the non-metallic frame, each of the plurality of cutouts contains a conductive material, and further wherein the conductive material in the plurality of cutouts forms a distributed electrical ground path extending along at least a portion of a perimeter of the piezoelectric material.
An ultrasound transducer, comprising:
- a planar stack including a piezoelectric layer and a lens layer;
- one or more flex circuits electrically coupled to the piezoelectric layer;
- and
- an overmould disposed between the one or more flex circuits and the piezoelectric layer, wherein the overmould is configured to mechanically secure the one or more flex circuits and electrically isolate at least a portion of a ground path from an active region of the piezoelectric layer.
A method of manufacturing an ultrasound transducer, comprising:
- forming a non-metallic frame having one or more cutouts;
- disposing a conductive material within the one or more cutouts;
- positioning a piezoelectric material within the non-metallic frame;
- and
- assembling the non-metallic frame and the piezoelectric material into a planar stack, wherein the conductive material forms an electrical ground path within the non-metallic frame.
Dependencies are inferred from the claim text.