H10N 30/071
Mounting of piezoelectric or electrostrictive parts together with semiconductor elements, or other
Official title: Mounting of piezoelectric or electrostrictive parts together with semiconductor elements, or other circuit elements, on a common substrate
H10N30/071 (Mounting of piezoelectric or electrostrictive parts together with semiconductor elements, or other) appears on 97 US grants and 138 published applications in this corpus.
Search patents in H10N- Granted patents
- 97
- Published applications
- 138
- Assignees
- 79
- Inventors
- 291
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 1 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 7 |
| 2012 | 0 | 2 |
| 2013 | 4 | 3 |
| 2014 | 3 | 7 |
| 2015 | 7 | 7 |
| 2016 | 4 | 5 |
| 2017 | 5 | 9 |
| 2018 | 4 | 14 |
| 2019 | 11 | 11 |
| 2020 | 7 | 10 |
| 2021 | 14 | 19 |
| 2022 | 7 | 7 |
| 2023 | 14 | 12 |
| 2024 | 4 | 17 |
| 2025 | 9 | 4 |
| 2026 | 3 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Integration techniques for micromachined pMUT arrays and electronics using solid liquid interdiffusion (SLID)11 Aug 2026US 12,704,626 B2Exo Imaging, Inc.
- Piezoelectric sensor with reduced process difficulty and manufacturing method therefor, and detection apparatus21 Apr 2026US 12,607,484 B2Boe Technology Group Co., Ltd.
- Interactive display device and method of manufacturing such a device21 Apr 2026US 12,610,863 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Configurable ultrasonic imager2 Dec 2025US 12,490,655 B2Exo Imaging, Inc.
- Semiconductor device with biofet and biometric sensors11 Nov 2025US 12,469,324 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for manufacturing array sensor element and array sensor element1 Oct 2026US 2026/0305173 A1Seiko Epson Corporation
- Tunable fiber scanner for all-fiber nonlinear microspectrometer and preparation method thereof19 Mar 2026US 2026/0079048 A1Tianjin University
- Semiconductor device with biofet and biometric sensors20 Nov 2025US 2025/0356685 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Chip-on-array with interposer for a multidimensional transducer array30 Oct 2025US 2025/0332613 A1Siemens Medical Solutions USA, Inc.
- Transducer arrays with air kerfs for intraluminal imaging23 Oct 2025US 2025/0325253 A1Koninklijke Philips N. V.
Most cited
By later US patents
- Method for manufacturing a vibrating MEMS circuit263US 9,369,105 B1RF Micro Devices, Inc. · 2016
- Suspension element having integrated piezo material for providing haptic effects to a touch screen54US 9,466,783 B2Immersion Corporation · 2016
- Harvesting power from multiple energy sources52US 9,197,143 B1Lord Corporation · 2015
- Micromachined piezoelectric X-Axis gyroscope28US 8,516,886 B2QUALCOMM MEMS Technologies, Inc. · 2013
- Micromachined piezoelectric x-axis gyroscope17US 8,584,522 B2QUALCOMM MEMS Technologies, Inc. · 2013