H10N 30/072
By laminating or bonding of piezoelectric or electrostrictive bodies
Official title: by laminating or bonding of piezoelectric or electrostrictive bodies
H10N30/072 (By laminating or bonding of piezoelectric or electrostrictive bodies) appears on 594 US grants and 763 published applications in this corpus.
Search patents in H10N- Granted patents
- 594
- Published applications
- 763
- Assignees
- 268
- Inventors
- 1,250
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 5 | 0 |
| 1998 | 5 | 0 |
| 1999 | 4 | 0 |
| 2000 | 6 | 0 |
| 2001 | 3 | 2 |
| 2002 | 1 | 8 |
| 2003 | 5 | 9 |
| 2004 | 5 | 18 |
| 2005 | 11 | 10 |
| 2006 | 14 | 10 |
| 2007 | 8 | 8 |
| 2008 | 5 | 11 |
| 2009 | 8 | 14 |
| 2010 | 9 | 18 |
| 2011 | 8 | 20 |
| 2012 | 5 | 20 |
| 2013 | 17 | 20 |
| 2014 | 22 | 32 |
| 2015 | 27 | 35 |
| 2016 | 24 | 17 |
| 2017 | 26 | 33 |
| 2018 | 19 | 51 |
| 2019 | 36 | 55 |
| 2020 | 45 | 68 |
| 2021 | 39 | 81 |
| 2022 | 40 | 55 |
| 2023 | 66 | 53 |
| 2024 | 49 | 50 |
| 2025 | 43 | 35 |
| 2026 | 22 | 30 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Hybrid structure for a surface acoustic wave device6 Oct 2026US 12,757,634 B2Soitec
- Heterostructure and method of fabrication22 Sep 2026US 12,744,508 B2Soitec
- Piezoelectric laminate, piezoelectric element, and manufacturing method for piezoelectric laminate15 Sep 2026US 12,740,323 B2FUJIFILM Corporation
- Integration techniques for micromachined pMUT arrays and electronics using solid liquid interdiffusion (SLID)11 Aug 2026US 12,704,626 B2Exo Imaging, Inc.
- Energy harvesting module and method of making an energy harvesting module11 Aug 2026US 12,706,553 B2TDK Corporation
- Method for producing a donor substrate for transferring a piezoelectric layer onto a carrier substrate8 Oct 2026US 2026/0312560 A1
- Method for preparing a single-domain thin layer made of lithium-containing ferroelectric material1 Oct 2026US 2026/0305174 A1
- Planar linear array for ultrasound24 Sep 2026US 2026/0283595 A1Fujifilm Sonosite, Inc.
- Bonded body, device, and method for producing bonded body10 Sep 2026US 2026/0271621 A1NGK Corporation
- Method for manufacturing a structure comprising a barrier layer to prevent diffusion of atomic species27 Aug 2026US 2026/0255879 A1
Most cited
By later US patents
- Method for producing an electronic component using direct bonding273US 5,771,555 AMatsushita Electric Industrial Co., Ltd. · 1998
- Method for producing piezoelectric composite substrate267US 8,932,686 B2Murata Manufacturing Co., Ltd. · 2015
- Thin layer composite unimorph ferroelectric driver and sensor142US 5,632,841 AThe United States of America as represented by the Administrator of the National Aeronautics and Space Administration · 1997
- Transversely-excited film bulk acoustic resonator with etch-stop layer113US 10,911,023 B2Resonant Inc. · 2021
- Piezoelectric/electrostrictive actuator having ceramic substrate having recess defining thin-walled portion76US 5,210,455 ANGK Insulators, Ltd. · 1993