Method for manufacturing two substrates called donor pseudo-substrates each comprising at least two tiles on a carrier substrate

Abstract

A method of manufacturing two substrates called pseudo-donor substrates, each comprising at least two wafer tiles on a carrier substrate, includes placing at least two tiles, on a first carrier substrate each tile having an initial thickness greater than or equal to 300 μm, so as to form a first pseudo-donor substrate comprising the at least two tiles, bonding the first pseudo-donor substrate to a second carrier substrate via the tiles, separating the tiles into two portions of a first thickness and of a second thickness so as to keep a first portion of the tiles having the first thickness on the first pseudo-donor substrate and transfer the second portion of the tiles having the second thickness onto the second carrier substrate to form a second pseudo-donor substrate the second thickness being between 20% and 80% of the initial thickness of the tiles of the first pseudo-donor substrate.

Dependencies are inferred from the claim text.