Enhancements for adhesive attachment of piezoelectric motor elements to a disk drive suspension
AssigneeHutchinson Technology Incorporated
InventorsGalen D. Houk, Thomas A. Schones, Tony S. Peterson
Life of this patent
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Abstract
Adhesive attachment features for bonding piezoelectric motors to a load beam substrate. The attachment features have one or more reliefs under or partially under or adjacent to a piezoelectric transducer to control the flow of adhesive by limiting or influencing adhesive travel or flow and simultaneously preventing excessive adhesive fillet height adjacent the piezoelectric motor while simultaneously providing for improved bond strength between the piezoelectric element and the load beam.
Claims29
An improved adhesive control substrate relief for bonding a piezoelectric motor to a substrate including at least one relief that extends around an outboard end of a bond pad area at an end of the piezoelectric motor.
An improved adhesive control substrate relief for bonding a piezoelectric motor to a substrate including at least one pair of reliefs, with one of the pair of reliefs extending along lateral edges for a distance equal to at least a majority of a lateral edge of a bond pad area of the piezoelectric motor, where the lateral edge of the bond pad area is parallel to a lateral edge of the piezoelectric motor.
An improved adhesive control substrate relief for bonding a piezoelectric motor to a substrate including at least one pair of reliefs, with one of the pair of reliefs extending along lateral edges of a bond pad area of the piezoelectric motor further comprising a relief that extends around an outboard end of a bond pad area at an end of the piezoelectric motor and is connected to the reliefs along the lateral edges in a connected, linear pattern.
An improved adhesive control substrate relief for bonding a piezoelectric motor to a substrate including at least one pair of reliefs, with one of the pair of reliefs extending along lateral edges of a bond pad area of the piezoelectric motor wherein an inner periphery of the relief is completely under the piezoelectric motor.
An improved adhesive control substrate relief for bonding a piezoelectric motor to a substrate including a relieved portion having a box shaped outer periphery and an enlarged generally cross-shaped inner periphery in a bond pad area for the piezoelectric motor.
An improved adhesive control substrate relief for bonding a piezoelectric motor to a substrate including at least one relieved portion in the substrate, with a portion of the bond pad area of the substrate relieved at an outboard end of a bond pad area of the piezoelectric motor.
Dependencies are inferred from the claim text.